2438-05-3Relevant articles and documents
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Biggerstaff,Wilds
, p. 2132,2135 (1949)
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Production of Terephthalic Acid from Corn Stover Lignin
Song, Song,Zhang, Jiaguang,G?zayd?n, G?kalp,Yan, Ning
supporting information, p. 4934 - 4937 (2019/02/24)
Funneling and functionalization of a mixture of lignin-derived monomers into a single high-value chemical is fascinating. Reported herein is a three-step strategy for the production of terephthalic acid (TPA) from lignin-derived monomer mixtures, in which redundant, non-uniform substitutes such as methoxy groups are removed and the desired carboxy groups are introduced. This strategy begins with the hydro-treatment of corn-stover-derived lignin oil over a supported molybdenum catalyst to selectively remove methoxy groups. The generated 4-alkylphenols are converted into 4-alkylbenzoic acids by carbonylation with carbon monoxide. The Co-Mn-Br catalyst then oxidizes various alkyl chains into carboxy groups, transforming the 4-alkylbenzoic acid mixture into a single product: TPA. For this route, the overall yields of TPA based on lignin content of corn stover could reach 15.5 wt %, and importantly, TPA with greater than 99 % purity was obtained simply by first decanting the reaction mixture and then washing the solid product with water.
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.