959087-75-3Relevant articles and documents
MONOALKOXYSILANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM
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Paragraph 0049-0050, (2021/03/19)
A method for making a dense organosilicon film with improved mechanical properties, the method comprising the steps of: providing a substrate within a reaction chamber introducing into the reaction chamber a gaseous composition comprising a novel monoalkoxysilane and applying energy to the gaseous composition comprising a novel monoalkoxysilane in the reaction chamber to induce reaction of the gaseous composition comprising a novel monoalkoxysilane to deposit an organosilicon film on the substrate, wherein the organosilicon film has a dielectric constant of from about 2.80 to about 3.30, an elastic modulus of from about 9 to about 32 GPa, and an at. % carbon of from about 10 to about 30 as measured by XPS.