Product Name

  • Name

    Copper(I) iodide

  • EINECS 231-674-6
  • CAS No. 7681-65-4
  • Article Data243
  • CAS DataBase
  • Density 5.62 g/cm3
  • Solubility insoluble in water
  • Melting Point 605 °C(lit.)
  • Formula CuI
  • Boiling Point 1290 °C
  • Molecular Weight 190.451
  • Flash Point 1290°C
  • Transport Information UN 3077 9/PG 3
  • Appearance white to grey or tan powder
  • Safety 22-24/25-26-61
  • Risk Codes 22-36/37/38-50/53
  • Molecular Structure Molecular Structure of 7681-65-4 (Copper(I) iodide)
  • Hazard Symbols HarmfulXn,DangerousN,IrritantXi
  • Synonyms Coppermonoiodide;Copper(1+) iodide;Copper(I) iodide;Cuprous iodide(CuI);Copper iodide (CuI);
  • PSA 0.00000
  • LogP -2.99850

Synthetic route

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of t-BuOCu added to a blue-green soln. of Sm complex; ppt. sepd. and washed with 10% HNO3; ppt. of CuI insoluble in HNO3 sepd. off; remaining soln. concd. and kept at 80° until complete dissolution of a fine ppt.; cooled slowly to ca. 20°; crystal sepd.; dried; identified by elem. anal., IR;A 100%
B 97.7%
C 92.3%
LaI3(tetrahydrofuran)3
147312-03-6

LaI3(tetrahydrofuran)3

copper (I) tert-butoxide
35342-67-7, 35342-68-8

copper (I) tert-butoxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

lanthanum tert-butoxycuprate

lanthanum tert-butoxycuprate

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of La complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum;A 90.2%
B 95%
tris(tetrahydrofurane)triiodidoneodymium(III)
113316-94-2

tris(tetrahydrofurane)triiodidoneodymium(III)

copper (I) tert-butoxide
35342-67-7, 35342-68-8

copper (I) tert-butoxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

neodymium tert-butoxycuprate

neodymium tert-butoxycuprate

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of Nd complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum;A n/a
B 90.3%
copper(II) choride dihydrate

copper(II) choride dihydrate

potassium iodide
7681-11-0

potassium iodide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water pptg. from a CuCl2*2H2O soln. with an excess of KI soln.; Debye-Scherrer XRD;
iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With copper(II) sulfate In not given iodine containing compounds used;
With alkali sulfite; copper(II) sulfate In not given iodine containing compounds used;
iodine
7553-56-2

iodine

copper(I) bromide
7787-70-4

copper(I) bromide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water; xylene byproducts: CuBr2; shaking a soln. of CuBr in concd. Br(1-) soln. with I2 in xylol, reversible react.;;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water; xylene byproducts: CuCl2; shaking a soln. of CuCl in concd. Cl(1-) soln. with I2 in xylol, reversible react.;;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

CuClI

CuClI

Conditions
ConditionsYield
In ethanol Kinetics; alcoholic soln. of iodine addn. to AgCl in container with ground stopper, keeping for 2, 4 or 8 h at 60°C; X-ray diffraction;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper dichloride

copper dichloride

Conditions
ConditionsYield
In acetone on addn. of a soln. of excess I2 acetone;;
sulfur dioxide
7446-09-5

sulfur dioxide

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
in presence of Cu(2+);
copper (II)-fluoride

copper (II)-fluoride

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuF2 at 60°C; X-ray diffraction;
copper(II) ion

copper(II) ion

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With sulfur dioxide In water Cu salts from Cu minerals;;
iodine
7553-56-2

iodine

copper(ll) bromide
7789-45-9

copper(ll) bromide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper(I) bromide
7787-70-4

copper(I) bromide

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuBr2 at 60°C; X-ray diffraction;
iodine
7553-56-2

iodine

copper dichloride

copper dichloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper(l) chloride

copper(l) chloride

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuCl2 at 60°C; X-ray diffraction;
copper(II) oxide

copper(II) oxide

methyl iodide
74-88-4

methyl iodide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In neat (no solvent) byproducts: aldehyde, O2, ethylene, methane, hydrocarbons; at about 310°C in aCO2-atmoshere;;
In neat (no solvent) on treatment of CuO with gaseous methyl iodide;;
ammonium iodide

ammonium iodide

copper(II) oxide

copper(II) oxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

ammonia
7664-41-7

ammonia

C

water
7732-18-5

water

D

iodine
7553-56-2

iodine

Conditions
ConditionsYield
In neat (no solvent) on heating to 400-500°C;;
In neat (no solvent) on heating to 400-500°C;;
copper(I) sulfide
22205-45-4

copper(I) sulfide

silver(I) iodide

silver(I) iodide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

silver sulfide

silver sulfide

Conditions
ConditionsYield
Kinetics; solid body react. under N2 at 200-300°C;
Kinetics; solid body react. in vac.at 200-300°C;
Kinetics; solid body react. under N2 at 200-300°C;
Kinetics; solid body react. in vac.at 200-300°C;
potassium iodide
7681-11-0

potassium iodide

copper(l) chloride

copper(l) chloride

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In hydrogenchloride pptn. with KI;;
In water pptn. from the soln. of CuCl in aq. NH4Cl with KI;;>99
In water react. of CuCl with KI-soln. with passing through of N2; washing with alcohol on a filter, drying in N2 flow and then in vacuum;
In hydrogenchloride
hydrogen iodide
10034-85-2

hydrogen iodide

copper(II) sulfide

copper(II) sulfide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water formation of crystals;;
potassium iodide
7681-11-0

potassium iodide

copper(II) oxide

copper(II) oxide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With hydrogenchloride; hydroxylamine hydrochloride; gelatin In water byproducts: N2O, KCl; NH2OH*HCl, KI added rapidly to gelatin stabilized CuO suspn. with stirring for 5 h under agitation at room temp., pH adjusted to 8-9 with HCl; washed thoroughly, vacuum dried at room temp.;
copper(l) iodide
7681-65-4

copper(l) iodide

trans-N,N'-bis(pyridin-2-ylmethylene)cyclohexane-1,2-diamine

trans-N,N'-bis(pyridin-2-ylmethylene)cyclohexane-1,2-diamine

CuI/Chxn-Py-Al

CuI/Chxn-Py-Al

Conditions
ConditionsYield
In diethyl ether; acetonitrile at 20℃; for 2h;100%
Conditions
ConditionsYield
In 1,2-dimethoxyethane Irradiation (UV/VIS); under Ar; mole ratio NaBPh4 : CuI = 1 : 1; irradn. (254 nm) for 1 h gave deposition of Cu; deposit sepd., washed with acetone and water, and dried in vac. to give pure Cu;100%
copper(l) iodide
7681-65-4

copper(l) iodide

methyllithium
917-54-4

methyllithium

MeCuILi

MeCuILi

Conditions
ConditionsYield
With N,N,N,N,N,N-hexamethylphosphoric triamide In tetrahydrofuran; diethyl ether under N2, etheral soln. of MeLi was added to a stirred suspn. of CuI in THF at -10°C, HMPT was also added, stirred for 30 min at 0°C; not isolated;100%
copper(l) iodide
7681-65-4

copper(l) iodide

tetrapropylammonium iodide
631-40-3

tetrapropylammonium iodide

bis(tetrapropylammonium) tetraiododicuprate(I)

bis(tetrapropylammonium) tetraiododicuprate(I)

Conditions
ConditionsYield
In tetrahydrofuran at 48℃; Inert atmosphere;100%
In acetonitrile dissolving CuI and NPr4I in MeCN, concg.;
copper(l) iodide
7681-65-4

copper(l) iodide

C48H38N2O6

C48H38N2O6

C48H38CuIN2O6

C48H38CuIN2O6

Conditions
ConditionsYield
In dichloromethane; acetonitrile at 20℃; for 2h;100%
copper(l) iodide
7681-65-4

copper(l) iodide

tetra-(n-butyl)ammonium iodide
311-28-4

tetra-(n-butyl)ammonium iodide

bis[(tetrabutylammonium) di-μ-iodo-diiododicuprate(I)] complex

bis[(tetrabutylammonium) di-μ-iodo-diiododicuprate(I)] complex

Conditions
ConditionsYield
In tetrahydrofuran; tert-butyl methyl ether at 10 - 48℃; for 0.75h; Inert atmosphere;100%
In tetrahydrofuran at 50℃; Inert atmosphere;600 g
Stage #1: copper(l) iodide; tetra-(n-butyl)ammonium iodide In tetrahydrofuran at 50℃; Inert atmosphere;
Stage #2: In tert-butyl methyl ether at 6℃; for 1h; Inert atmosphere;
600 g
copper(l) iodide
7681-65-4

copper(l) iodide

rac-1,2-bis[tert-butyl(anilin-2-ylthio)phosphanyl]-1,2-dicarbacloso-dodecaborane(12)

rac-1,2-bis[tert-butyl(anilin-2-ylthio)phosphanyl]-1,2-dicarbacloso-dodecaborane(12)

C22H40B10CuN2P2S2(1+)*I(1-)

C22H40B10CuN2P2S2(1+)*I(1-)

Conditions
ConditionsYield
In tetrahydrofuran at 20℃; for 18h; Inert atmosphere; Schlenk technique; stereoselective reaction;100%
copper(l) iodide
7681-65-4

copper(l) iodide

lead(II) nitrate

lead(II) nitrate

potassium iodide
7681-11-0

potassium iodide

copper lead iodide

copper lead iodide

Conditions
ConditionsYield
Stage #1: copper(l) iodide; lead(II) nitrate; potassium iodide In water for 2h;
Stage #2: at 620℃; for 72h; Sealed tube;
100%
copper(l) iodide
7681-65-4

copper(l) iodide

5-chloro-2-(pent-4-yn-1-yl)pyrimidine
126215-85-8

5-chloro-2-(pent-4-yn-1-yl)pyrimidine

(5-(5-chloropyrimidin-2-yl)pent-1-yn-1-yl)copper

(5-(5-chloropyrimidin-2-yl)pent-1-yn-1-yl)copper

Conditions
ConditionsYield
With potassium carbonate In N,N-dimethyl-formamide at 20℃; for 3h; Inert atmosphere;100%
copper(l) iodide
7681-65-4

copper(l) iodide

N,N-diethylphenylazothioformamide

N,N-diethylphenylazothioformamide

C22H30Cu2I2N6S2

C22H30Cu2I2N6S2

Conditions
ConditionsYield
In tetrahydrofuran100%
copper(l) iodide
7681-65-4

copper(l) iodide

2,6-bis(5-(tert-butyl)-1H-pyrazol-3-yl)pyridine
1380612-64-5

2,6-bis(5-(tert-butyl)-1H-pyrazol-3-yl)pyridine

C38H50Cu3I3N10

C38H50Cu3I3N10

Conditions
ConditionsYield
In tetrahydrofuran for 24h; Inert atmosphere; Schlenk technique;100%
copper(l) iodide
7681-65-4

copper(l) iodide

[((p-tert-butyl)C6H4)2B(CH2P(phenyl)2)2][5-azoniaspiro[4.4]nonane]
591215-89-3

[((p-tert-butyl)C6H4)2B(CH2P(phenyl)2)2][5-azoniaspiro[4.4]nonane]

[[(p-(t)BuPh)2B(CH2PPh2)2]CuI][5-azonia-spiro[4.4]nonane]
820219-08-7

[[(p-(t)BuPh)2B(CH2PPh2)2]CuI][5-azonia-spiro[4.4]nonane]

Conditions
ConditionsYield
In tetrahydrofuran; ethanol equiv. amt. of solid CuI and B-compd. were mixed in THF:EtOH=4:0.3, stirring for 2.5 h; volatiles were removed in vac., solid was washed with Et2O, dried in vac., elem. anal.;99.4%
copper(l) iodide
7681-65-4

copper(l) iodide

6-bromo-2,2,4,4-tetramethyl chroman-8-carbaldehyde
345964-32-1

6-bromo-2,2,4,4-tetramethyl chroman-8-carbaldehyde

trimethylsilylacetylene
1066-54-2

trimethylsilylacetylene

6-Trimethylsilanylethynyl-2,2,4,4-tetramethyl chroman-8-carbaldehyde
607714-16-9

6-Trimethylsilanylethynyl-2,2,4,4-tetramethyl chroman-8-carbaldehyde

Conditions
ConditionsYield
With triethylamine; dichlorobis(triphenylphosphine)palladium[II] In tetrahydrofuran; hexane99%
copper(l) iodide
7681-65-4

copper(l) iodide

ethyl 8-iodo-2,2,4,4-tetramethyl-chroman-6-carboxylate
607713-99-5

ethyl 8-iodo-2,2,4,4-tetramethyl-chroman-6-carboxylate

trimethylsilylacetylene
1066-54-2

trimethylsilylacetylene

Ethyl-8-trimethylsilanyl-ethynyl-2,2,4,4-tetramethyl chroman-6-carboxylate
607714-00-1

Ethyl-8-trimethylsilanyl-ethynyl-2,2,4,4-tetramethyl chroman-6-carboxylate

Conditions
ConditionsYield
dichlorobis(triphenylphosphine)palladium[II] In hexane; triethylamine99%
copper(l) iodide
7681-65-4

copper(l) iodide

methyllithium
917-54-4

methyllithium

lithium dimethylcuprate
15681-48-8

lithium dimethylcuprate

Conditions
ConditionsYield
In diethyl ether at -78 - -35℃; for 0.333333h; Inert atmosphere;99%
In tetrahydrofuran Ar, ratio CuI:CH3Li = 1:2;
In hexane
pyridine
110-86-1

pyridine

copper(l) iodide
7681-65-4

copper(l) iodide

Cu4(pyridine)4I4

Cu4(pyridine)4I4

Conditions
ConditionsYield
With KI In water pyridine was added to stirred soln. of CuI in concd. aq. KI; filtered; washed (satd. aq. KI, H2O, MeOH, hexane); recrystd. (CH2Cl2/pentane); dried (vac.);99%
In ethanol at 20℃; for 0.5h; Sealed tube;80%
With potassium iodide In water
copper(l) iodide
7681-65-4

copper(l) iodide

Iodotrifluoroethylene
359-37-5

Iodotrifluoroethylene

cadmium
7440-43-9

cadmium

trifluorovinyl copper
102682-87-1

trifluorovinyl copper

Conditions
ConditionsYield
In N,N-dimethyl-formamide byproducts: CdI2; N2; slight excess of acid-washed Cd powder added to alkene soln.; mild exothermic reaction after induction period; removal of excess Cd by press. filtrn. under N2; stirring mixt. at 0 °C for half h with CuI or CuBr; final warming to room temp.; (19)F NMR;99%
copper(l) iodide
7681-65-4

copper(l) iodide

Ag4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Ag4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Cu4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Cu4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Conditions
ConditionsYield
In not given treated at room temp. for 24 h; further intermediate; followed by UV and by ESI-MS;99%
piperidine
110-89-4

piperidine

copper(l) iodide
7681-65-4

copper(l) iodide

Cu4(piperidine)4I4

Cu4(piperidine)4I4

Conditions
ConditionsYield
In dichloromethane piperidine was dissolved in CH2Cl2 under N2 at 25°C; CuI was added; mixt. was stirred under N2 until CuI dissolved;99%
With potassium iodide In acetone excess of ligand in acetone soln. is added to a stirred soln. of CuI in concd. aq. KI soln., soln. kept standing for a few min, pptn.; filtn., washing with satd. aqueous KI, water, MeOH and hexanes, product is dried in vac.;>99
With potassium iodide In water
copper(l) iodide
7681-65-4

copper(l) iodide

cis[(μ-N(t-Bu)P)2(NC4H8O)2]
73605-90-0

cis[(μ-N(t-Bu)P)2(NC4H8O)2]

acetonitrile
75-05-8

acetonitrile

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8O)8]

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8O)8]

Conditions
ConditionsYield
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1);99%
copper(l) iodide
7681-65-4

copper(l) iodide

cis[(μ-N(t-Bu)P)2(NC4H8NMe)2
1038988-00-9

cis[(μ-N(t-Bu)P)2(NC4H8NMe)2

acetonitrile
75-05-8

acetonitrile

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8NMe)8]

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8NMe)8]

Conditions
ConditionsYield
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1);99%
N,N'-ethylenethiourea
96-45-7

N,N'-ethylenethiourea

copper(l) iodide
7681-65-4

copper(l) iodide

tris(iodobis(ethylenethiourea)copper(I))
1094209-90-1

tris(iodobis(ethylenethiourea)copper(I))

Conditions
ConditionsYield
In N,N-dimethyl-formamide CuI, ethylenethiourea and few drops DMF were ground together for severalminutes; DMF was evapd.;99%
In water CuI and ethylenethiourea in water were heated to boiling; supernatant was decanted while hot and cooled, product was collected andwashed with water; elem. anal.;50%
copper(l) iodide
7681-65-4

copper(l) iodide

triacetylacetonatotripyridinetetrasulfido trimolybdenum hexafluorophosphate
443287-45-4

triacetylacetonatotripyridinetetrasulfido trimolybdenum hexafluorophosphate

benzene
71-43-2

benzene

triacetylacetonatotripyridinetetrasulfidomonoiodidocoppertrimolybdenum hexafluorophosphate - benzene (1/4)

triacetylacetonatotripyridinetetrasulfidomonoiodidocoppertrimolybdenum hexafluorophosphate - benzene (1/4)

Conditions
ConditionsYield
In dichloromethane; acetonitrile; benzene stoich., CuI added to soln. of Mo complex in CH2Cl2, evapd., dissolved (CH3CN), benzene deposited; crystd. for 3 d, elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

4,5-bis(diphenylphosphino)-9,9-dimethylxanthene
161265-03-8

4,5-bis(diphenylphosphino)-9,9-dimethylxanthene

Cu[9,9-dimethyl-4,5-bis(diphenylphosphine)xanthene]I
1218788-80-7

Cu[9,9-dimethyl-4,5-bis(diphenylphosphine)xanthene]I

Conditions
ConditionsYield
In acetonitrile99%
In CH2Cl299%
In acetonitrile at 50℃; for 2h;99%
copper(l) iodide
7681-65-4

copper(l) iodide

1,2-bis(diphenylphosphino)-1′-(diisopropylphosphino)-4-tert-butylferrocene
776315-37-8

1,2-bis(diphenylphosphino)-1′-(diisopropylphosphino)-4-tert-butylferrocene

P,P',P''-[1,2-bis(diphenylphosphino)-1'-(diisopropylphosphino)-4-tert-butylferrocene]iodocopper(I)
1231929-92-2

P,P',P''-[1,2-bis(diphenylphosphino)-1'-(diisopropylphosphino)-4-tert-butylferrocene]iodocopper(I)

Conditions
ConditionsYield
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

1-diphenylphosphino-2-diphenylphosphino-4-tert-butyl-cyclopentadienyl-1'-diphenylphosphino-3'-tert-butyl-cyclopentadienyliron
1159850-42-6

1-diphenylphosphino-2-diphenylphosphino-4-tert-butyl-cyclopentadienyl-1'-diphenylphosphino-3'-tert-butyl-cyclopentadienyliron

P,P',P''-[1,1',2-tris(diphenylphosphino)-3',4-di-tert-butylferrocene]iodocopper(I)
1231929-91-1

P,P',P''-[1,1',2-tris(diphenylphosphino)-3',4-di-tert-butylferrocene]iodocopper(I)

Conditions
ConditionsYield
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

bis(diethylamino)-2,3,4,5,6-pentafluorophenylphosphane
13648-83-4

bis(diethylamino)-2,3,4,5,6-pentafluorophenylphosphane

bis[bis(diethylamino)(pentafluorophenyl)phosphate]iodidocopper(I)
1311311-97-3

bis[bis(diethylamino)(pentafluorophenyl)phosphate]iodidocopper(I)

Conditions
ConditionsYield
In chloroform-d1 inert gas; CuI (0.36 mmol) added to soln. of ligand (0.70 mmol), mixt. stirred at room temp. for 30 min; filtered, evapd.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

tris(3,5-dimethylpyrazolyl)methane
28791-97-1

tris(3,5-dimethylpyrazolyl)methane

(tris(3,5-dimethyl-1-pyrazolyl)methane)CuI
1392097-26-5

(tris(3,5-dimethyl-1-pyrazolyl)methane)CuI

Conditions
ConditionsYield
In acetonitrile under N2; soln. of ligand in MeCN added to stirred soln. of CuI in MeCN;stirred for 2 h; filtered; ppt. dried under vac.; elem. anal.;99%
at 20℃;

CUPROUS IODIDE Chemical Properties

IUPAC Name:copper(1+) iodide
Molecular Formula:CuI
Molecular Weight:190.45 
EINECS:231-674-6 
Density:5.62 g/mL at 25 °C(lit.)
Melting Point:605 °C
Boiling Point:1290 °C
Solubility:Insoluble in water
Sensitive:Air & Moisture Sensitive
Appearance:Off white powder
Cuprous iodide's(7681-65-4) Synonyms: Copper iodide (CuI);CuI;Hydro-giene;Marshite;COPPER(+1)IODIDE;COPPER IODIDE;COPPER(I) IODIDE;Ciras
Cuprous iodide's(7681-65-4) Molecular Structure:

CUPROUS IODIDE Uses

Cuprous iodide(7681-65-4) can be used as a catalyst in organic reactions.

CUPROUS IODIDE Safety Profile

When heated to decomposition it emits toxic fumes of I.

Safety Information of Cuprous iodide(7681-65-4)
Hazard Codes  Xn,N,Xi
Risk Statements  22-36/37/38-50/53
Safety Statements  22-24/25-26-61
RIDADR  UN 3077 9/PG 3
WGK Germany  3
F  8
HS Code  28276000

CUPROUS IODIDE Standards and Recommendations

ACGIH TLV: TWA (fume) 0.2 mg/m3; (dust, mist) 1 mg(Cu)/m3

CUPROUS IODIDE Specification

Stability and Reactivity of Cuprous iodide(7681-65-4)
【Disposal Code】15
【Incompatibilities】Oxidizing agents, alkali metals, potassium, acetylene.
【Stability】Stable under normal temperatures and pressures.
【Decomposition】Hydrogen iodide, iodine.
【Combustion Products】Fire may produce irritating, corrosive and/or toxic gases.

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