104175-23-7 Usage
General Description
2,4-diethylbenzoic acid is an organic compound with the chemical formula C12H16O2. It is a derivative of benzoic acid with two ethyl groups attached to the 2 and 4 positions of the benzene ring. 2,4-diethylbenzoic acid is commonly used as an intermediate in the synthesis of pharmaceuticals, dyes, and other organic compounds. It has also been studied for its potential antioxidant and anti-inflammatory properties. Additionally, 2,4-diethylbenzoic acid has been used as a corrosion inhibitor and as a component in the production of plasticizers and fragrances. Overall, this chemical has a wide range of industrial and potential medicinal applications.
Check Digit Verification of cas no
The CAS Registry Mumber 104175-23-7 includes 9 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 6 digits, 1,0,4,1,7 and 5 respectively; the second part has 2 digits, 2 and 3 respectively.
Calculate Digit Verification of CAS Registry Number 104175-23:
(8*1)+(7*0)+(6*4)+(5*1)+(4*7)+(3*5)+(2*2)+(1*3)=87
87 % 10 = 7
So 104175-23-7 is a valid CAS Registry Number.
104175-23-7Relevant articles and documents
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
