22928-28-5 Usage
General Description
2,4-Dihydroxy-1,3-benzenedicarboxylic acid, also known as protocatechuic acid, is a natural phenolic compound found in various fruits and vegetables. It is a metabolite of benzoic acid and is known for its antioxidant and anti-inflammatory properties. Protocatechuic acid has been studied for its potential health benefits, including its ability to reduce oxidative stress and inflammation, and its potential to protect against certain chronic diseases such as diabetes, cardiovascular disease, and cancer. Additionally, it has shown promise in protecting against liver and kidney damage, as well as promoting overall health and wellbeing. Protocatechuic acid can be found in various food sources, and its potential health benefits make it of interest for further research and potential therapeutic applications.
Check Digit Verification of cas no
The CAS Registry Mumber 22928-28-5 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 2,2,9,2 and 8 respectively; the second part has 2 digits, 2 and 8 respectively.
Calculate Digit Verification of CAS Registry Number 22928-28:
(7*2)+(6*2)+(5*9)+(4*2)+(3*8)+(2*2)+(1*8)=115
115 % 10 = 5
So 22928-28-5 is a valid CAS Registry Number.
22928-28-5Relevant articles and documents
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
