24535-13-5 Usage
General Description
3-(2-hydroxyphenyl)propanohydrazide, also known as Iproniazid, is a chemical compound belonging to the class of hydrazides. It is primarily used as a monoamine oxidase inhibitor (MAOI), a type of antidepressant that works by increasing the levels of certain neurotransmitters in the brain. Iproniazid was one of the first MAOIs to be developed and used in the treatment of depression and tuberculosis. It has also been studied for its potential neuroprotective and anti-inflammatory properties. The chemical structure of 3-(2-hydroxyphenyl)propanohydrazide contains a phenol group, a propyl chain, and a hydrazide moiety, making it a versatile compound with potential therapeutic applications.
Check Digit Verification of cas no
The CAS Registry Mumber 24535-13-5 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 2,4,5,3 and 5 respectively; the second part has 2 digits, 1 and 3 respectively.
Calculate Digit Verification of CAS Registry Number 24535-13:
(7*2)+(6*4)+(5*5)+(4*3)+(3*5)+(2*1)+(1*3)=95
95 % 10 = 5
So 24535-13-5 is a valid CAS Registry Number.
InChI:InChI=1/C9H12N2O2/c10-11-9(13)6-5-7-3-1-2-4-8(7)12/h1-4,12H,5-6,10H2,(H,11,13)
24535-13-5Relevant articles and documents
Epoxy resin bearing diacylhydrazine moiety as a degradable adhesive for traceless oxidative removal
Oguri, Takahiro,Kawahara, Akie,Kihara, Nobuhiro
, p. 83 - 89 (2016/07/19)
Bisphenols functionalized with diacylhydrazine moieties and ester groups were prepared from 5-hydroxyisophthalic acid by esterification and partial hydrazination, followed by oxidative coupling of the obtained hydrazide. Ester groups with long alkyl chains or polyether increased the solubility of bisphenols in the epoxy resin. The epoxy resin was cured by heating with bisphenols in the presence of a catalytic amount of imidazole, with more rapid curing observed for more soluble bisphenols. The cured resin, with Td5?≈?300?°C, decomposed rapidly when exposed to sodium hypochlorite solution. The above resin could be used as a strong and tough adhesive for metal and glass, whereas it can be easily removed by treatment with sodium hypochlorite solution without any trace. The observed dismantling rate positively correlated with bisphenol solubility.
