25068-38-6 Usage
Description
Bisphenol A diglycidyl ether resin, also known as poly(Bisphenol-A-co-epichlorohydrin) (PBE), is a pale yellow liquid epoxy compound formed by the polycondensation of epichlorohydrin (ECH) and bisphenol A (BPA). It is a phenoxy polymer with epoxy groups located at both ends of the molecule, which can undergo reactions of ring-opening, cross-linking, and solidity with amines, anhydrides, and other curing agents of epoxy resins. This makes it an effective adhesion for most substrates such as glass, ceramics, silicon wafers, and polymer materials.
Uses
Used in Electronics, Optical, and Aerospace Applications:
Bisphenol A diglycidyl ether resin is used as a reinforcing polymer on nanotubes and nanoparticles, making it suitable for various applications in the electronics, optical, and aerospace industries. Its reinforcing properties enhance the performance of these materials in their respective fields.
Used in Microscopy:
Araldite 506 epoxy resin, a type of Bisphenol A diglycidyl ether resin, has been used as an embedding medium for microscopy. This application takes advantage of the resin's properties to provide a stable and supportive medium for sample preparation and analysis.
Used in Packaging Materials:
Bisphenol A diglycidyl ether resin is used as a packaging material for coatings, adhesives, insulating paints, semiconductors, and integrated circuits and other electronic components. Its versatility and adhesive properties make it an ideal choice for these applications.
Used in Canned Food Packaging:
In recent years, Bisphenol A diglycidyl ether resin has been used for the inner coating of packaging materials such as canned food. This application utilizes the resin's properties to provide a protective and stable coating for the packaging, ensuring the quality and safety of the food products.
Used in Electrochemical Devices:
Bisphenol A diglycidyl ether resin can also be used in the formation of solid polymeric electrolyte for potential application in electrochemical devices. This application leverages the resin's properties to improve the performance and efficiency of these devices.
Preparation
Add bisphenol A and epichlorohydrin in the amount of 1:4 into a three-necked flask equipped with a reflux device, place it in a constant-temperature oil bath, melt it with 70 °C of heat, and dropwise 28.57% aqueous sodium hydroxide solution with a dropping funnel, in which the ratio of the amount of sodium hydroxide and bisphenol A is 4:1. When dropping is completed within half an hour, heat it for 12-24 hours under temperature 70-80°C。 Stop the heating after bisphenol A is completely disappeared validated by TLC method. Cool the mixture to room temperature; add extractant toluene/water (volume ratio 2:1) and stir it at room temperature for half an hour. Transfer to a pear-shaped separatory funnel to separate the liquid, continue washing and separating with deionized water until the solution turns to neutral from alkaline. Distillation and vacuum distillation are used to remove toluene and unreacted epichlorohydrin, respectively. Use a solvent mixture of petroleum ether and ethyl acetate (volume ratio 3:1) a developing solvent to purify it by column chromatography according to the above procedure to obtain DGEBA.
This process, also known as a one-step process, is commonly used for the preparation of low and medium molecular weight bisphenol A epoxy resins.
When the low-molecular-weight bisphenol A epoxy resin is continuously reacted with bisphenol A, the obtained bisphenol A epoxy resin has a high polymerization with a relative molecular mass 1400 or more. This is called a two-step method. When the number-average molecular weight is less than 400, the main component is bisphenol A diglycidyl ether (DGEBA, relative molecular weight 340). To fix the amount of fixed bisphenol A and make excess epichlorohydrin can obtain DGEBA. The reaction process is as follows:
As can be seen from above, the product is bisphenol A diglycidyl ether when there is sufficient epichlorohydrin and enough sodium hydroxide as the catalyst. Excessive amounts of bisphenol A generate linear high molecular compounds with hydroxyl-, etherand epoxy-terminated groups. The internal rotation function of the ether bond increases the flexibility of the molecule, and the hydroxyl group enhances the chemical reactivity and the bonding ability, the epoxy group cross-links molecules into a three-dimensional network structure by reacting with a curing agent. The performance represented by each part of the Bisphenol A-type epoxy resin is shown here:
Check Digit Verification of cas no
The CAS Registry Mumber 25068-38-6 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 2,5,0,6 and 8 respectively; the second part has 2 digits, 3 and 8 respectively.
Calculate Digit Verification of CAS Registry Number 25068-38:
(7*2)+(6*5)+(5*0)+(4*6)+(3*8)+(2*3)+(1*8)=106
106 % 10 = 6
So 25068-38-6 is a valid CAS Registry Number.
InChI:InChI=1/C15H16O2.C3H5ClO/c1-15(2,11-3-7-13(16)8-4-11)12-5-9-14(17)10-6-12;4-1-3-2-5-3/h3-10,16-17H,1-2H3;3H,1-2H2
