2790-09-2Relevant articles and documents
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
From Fourfold Functionalized Cyclophanes to Tube-Shaped Molecules
Schroeder, Axel,Karbach, Detlef,Guether, Ralf,Voegtle, Fritz
, p. 1881 - 1888 (2007/10/02)
A series of fourfold functionalized 2,11-dithia- and 2,11-diazacyclophanes 15-17 and 18-22, resp., is prepared by using a new multistep-strategy starting from 7 of m-xylene, respectively.The cyclophanes are used to construct tube-shaped molecules of