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2790-09-2

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2790-09-2 Usage

General Description

4,6-Dimethylisophthalic acid is a chemical compound with the formula C10H10O4. It is a derivative of isophthalic acid, with two methyl groups attached to the 4 and 6 positions of the benzene ring. 4,6-Dimethylisophthalic Acid is used primarily as a monomer in the production of high-performance polymers and resins, such as polyesters and polyamides. It is also used as a building block for the synthesis of various pharmaceuticals and agrochemicals. 4,6-Dimethylisophthalic acid has potential applications in a wide range of industries, including plastics, textiles, and pharmaceuticals, due to its unique chemical and physical properties.

Check Digit Verification of cas no

The CAS Registry Mumber 2790-09-2 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 2,7,9 and 0 respectively; the second part has 2 digits, 0 and 9 respectively.
Calculate Digit Verification of CAS Registry Number 2790-09:
(6*2)+(5*7)+(4*9)+(3*0)+(2*0)+(1*9)=92
92 % 10 = 2
So 2790-09-2 is a valid CAS Registry Number.
InChI:InChI=1/C10H10O4/c1-5-3-6(2)8(10(13)14)4-7(5)9(11)12/h3-4H,1-2H3,(H,11,12)(H,13,14)

2790-09-2SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 11, 2017

Revision Date: Aug 11, 2017

1.Identification

1.1 GHS Product identifier

Product name 4,6-dimethylbenzene-1,3-dicarboxylic acid

1.2 Other means of identification

Product number -
Other names 1,3-Benzenedicarboxylic acid, 4,6-dimethyl-

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:2790-09-2 SDS

2790-09-2Relevant articles and documents

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

-

, (2014/03/21)

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

From Fourfold Functionalized Cyclophanes to Tube-Shaped Molecules

Schroeder, Axel,Karbach, Detlef,Guether, Ralf,Voegtle, Fritz

, p. 1881 - 1888 (2007/10/02)

A series of fourfold functionalized 2,11-dithia- and 2,11-diazacyclophanes 15-17 and 18-22, resp., is prepared by using a new multistep-strategy starting from 7 of m-xylene, respectively.The cyclophanes are used to construct tube-shaped molecules of

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