5167-76-0

Basic information

• Product Name: 2,5-dihydroxyisophthalic acid
• Synonyms: 2,5-dihydroxyisophthalic acid
• CAS NO: 5167-76-0
• Molecular Weight: 198.132
• Mol File: 5167-76-0.mol
• Article Data: 3

Chemical Properties

• CAS DataBase Reference: 2,5-dihydroxyisophthalic acid(CAS DataBase Reference)
• NIST Chemistry Reference: 2,5-dihydroxyisophthalic acid(5167-76-0)
• EPA Substance Registry System: 2,5-dihydroxyisophthalic acid(5167-76-0)

Safety Data

• Hazardous Substances Data: 5167-76-0(Hazardous Substances Data)

Upstream product

• 83-40-9 3-methylsalicylic acid 
• 606-19-9 2-hydroxyisophthalic acid 
• 14538-50-2 1,3-dimethyl-2,5-dimethoxybenzene 
• 627101-26-2 2,5-dimethoxy-isophthalic acid 
• 654-42-2 1,4-dihydroxy-2,6-dimethylbenzene 

Relevant articles and documents

Tenacic Acids: A New Class of Tenacious Binders to Metal Oxide Surfaces

The backbone of 2-hydroxyisophthalic acid was identified as a potential metal oxide anchor because of the perfect alignment of all three of its donor groups for binding to inorganic surfaces. It can therefore be used in the design of organic linkers for m

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.