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59501-41-6

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59501-41-6 Usage

Description

(3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE is a silane compound that contains a silicon atom bonded to three organic groups and one halogen atom. It features a bromine atom and a propoxy group attached to the silicon atom, along with tert-butyldimethylsilyl groups. This chemical is utilized in the synthesis of various organic compounds and serves as a reagent in organic synthesis reactions, particularly for the protection and deprotection of functional groups.

Uses

Used in Organic Synthesis:
(3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE is used as a reagent in organic synthesis for the protection and deprotection of functional groups, enabling the selective modification of target molecules in complex organic structures.
Used in Pharmaceutical Production:
(3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE serves as a precursor in the production of pharmaceuticals and other fine chemicals, contributing to the development of new drugs and therapeutic agents.
Used in Chemical Research:
(3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE is also utilized in chemical research for studying the properties and reactions of silane compounds, furthering the understanding of their applications in various fields.
Safety Note:
It is crucial to handle (3-BROMOPROPOXY)-TERT-BUTYLDIMETHYLSILANE with care due to its flammable nature and potential for violent reactions with water or air. Proper safety measures should be taken during its use and storage.

Check Digit Verification of cas no

The CAS Registry Mumber 59501-41-6 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 5,9,5,0 and 1 respectively; the second part has 2 digits, 4 and 1 respectively.
Calculate Digit Verification of CAS Registry Number 59501-41:
(7*5)+(6*9)+(5*5)+(4*0)+(3*1)+(2*4)+(1*1)=126
126 % 10 = 6
So 59501-41-6 is a valid CAS Registry Number.

59501-41-6Relevant articles and documents

THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND

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Paragraph 0454; 0455; 0460, (2018/06/15)

The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.

COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

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Page/Page column, (2015/06/03)

There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF

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Paragraph 0336, (2014/09/02)

Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, a cured product of the composition and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, a glycidylation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, a cured product of the composition and a use of the composition are provided. The composite of the composition comprising the alkoxysilylated epoxy compound exhibits improved chemical bonding,-good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less via the enhanced chemical bonding efficiency of alkoxysilyl group. The cured product of the composition exhibits good flame retardant properties.

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