91715-62-7

Basic information

• Product Name: 3,4-dimethylphthalic acid
• Synonyms: 3,4-dimethylphthalic acid
• CAS NO: 91715-62-7
• Molecular Weight: 194.187
• Mol File: 91715-62-7.mol
• Article Data: 2

Chemical Properties

• CAS DataBase Reference: 3,4-dimethylphthalic acid(CAS DataBase Reference)
• NIST Chemistry Reference: 3,4-dimethylphthalic acid(91715-62-7)
• EPA Substance Registry System: 3,4-dimethylphthalic acid(91715-62-7)

Safety Data

• Hazardous Substances Data: 91715-62-7(Hazardous Substances Data)

Upstream product

• 201230-82-2 carbon monoxide 
• 603-79-2 2,3-dimethylbenzoic acid 
• 67-64-1 acetone 

Downstream Products

• 5555-21-5 3,4-dimethyl-phthalic acid anhydride 

Relevant articles and documents

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.