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94680-04-3

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94680-04-3 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 94680-04-3 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 9,4,6,8 and 0 respectively; the second part has 2 digits, 0 and 4 respectively.
Calculate Digit Verification of CAS Registry Number 94680-04:
(7*9)+(6*4)+(5*6)+(4*8)+(3*0)+(2*0)+(1*4)=153
153 % 10 = 3
So 94680-04-3 is a valid CAS Registry Number.

94680-04-3Relevant articles and documents

Thermo-mechanical and surface properties of POSS reinforced structurally different diamine cured epoxy nanocomposites

Sethuraman,Prabunathan,Alagar

, p. 45433 - 45441 (2014)

In the present study three structurally different diamines namely bisphenol-A based ether diamine, octane diol based ether diamine, and capron based diamine were synthesized and characterized using FT-IR, 1H-NMR and 13C-NMR spectra. These diamines were used to cure DGEBA epoxy resin and were reinforced with NH2-POSS in different weight percentages (1%, 3% and 5% wt) to obtain epoxy matrices and composites. Data obtained from thermo-mechanical, dielectric and surface studies were compared with those of neat epoxy matrix cured with diamino diphenyl methane (DDM). The surface morphology was ascertained from the XRD and SEM analysis and the presence of POSS in the composites was ascertained from the TEM images. The capron based diamine cured epoxy matrix shows better improvement in tensile strength and impact strength of 39.8% and 137.0% respectively than those of neat epoxy cured with diamino diphenyl methane (DDM). The value of contact angle (91.3°) of the capron based diamine cured epoxy composites infers that the epoxy matrix becomes hydrophobic nature. Data obtained from different studies suggest that the capron diamine cured epoxy matrix can be used in the form of a coating, encapsulant, or a sealant for different industrial and engineering applications for better performance and improved longevity. This journal is

The effect of even-odd methylene spacer groups on the thermal stability of epoxy-amine polymers

Shakil, Maria,Akhter, Toheed,Siddiqi, Humaira Masood,Akhtar, Zareen

, p. 92 - 98 (2015/05/20)

A series of some novel epoxy-amine polymers was successfully synthesized by using DGEBA and aromatic diamines as starting materials. The cured free standing flexible polymer films were characterized by FTIR, DSC, TGA, and WAXD. The values of Tg

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