6268-25-3

Basic information

• Product Name: butyl 3-nitrobenzoate
• CAS NO: 6268-25-3
• Molecular Formula: C₁₁H₁₃NO₄
• Molecular Weight: 223.2252
• Mol File: 6268-25-3.mol
• Article Data: 17

Chemical Properties

• Boiling Point: 327.5°C at 760 mmHg
• Flash Point: 139.1°C
• Density: 1.183g/cm³
• Vapor Pressure: 0.000201mmHg at 25°C
• Refractive Index: 1.532
• CAS DataBase Reference: butyl 3-nitrobenzoate(CAS DataBase Reference)
• NIST Chemistry Reference: butyl 3-nitrobenzoate(6268-25-3)
• EPA Substance Registry System: butyl 3-nitrobenzoate(6268-25-3)

Safety Data

• Hazardous Substances Data: 6268-25-3(Hazardous Substances Data)

Upstream product

• 121-92-6 3-nitrobenzoic acid 
• 71-36-3 butan-1-ol 
• 121-90-4 m-nitrobenzoic acid chloride 
• 86453-93-2 3-nitrobenzaldehyde di-n-butyl acetal 
• 109-65-9 1-bromo-butane 
• 136-60-7 benzoic acid, butyl ester 
• 7697-37-2 nitric acid 
• 5923-22-8 normal butyl hypochlorite 
• 99-61-6 3-nitro-benzaldehyde 
• 109-69-3 n-Butyl chloride 
• 72802-41-6 2-hydroxy-1-(3-nitrophenyl)ethan-1-one 
• 621-50-1 (3-nitrophenyl)acetonitrile 

Downstream Products

• 26218-03-1 butyl ester of m-aminobenzoic acid 
• 59265-88-2 3-Isocyanato-benzoic acid butyl ester 
• 58055-29-1 3-(3,3-Dimethyl-ureido)-benzoic acid butyl ester 

Relevant articles and documents

A facile, one-pot procedure for the conversion of aromatic aldehydes to esters, as well as thioesters and amides, via acyl hydrazide intermediates

Herein we present an efficient method for the synthesis of esters from aromatic aldehydes via readily accessible acyl hydrazides. The developed reaction protocol is shown to be tolerant of a range of aromatic aldehydes, bearing various functionalities, as well as being amenable to the synthesis of thioesters and amides.

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Transition-metal-free aerobic oxidative cleavage of C-C bonds in α-hydroxy ketones and mechanistic insight to the reaction pathway

Clear cut: For the title reaction, O2, the ideal oxidant, was used as the only oxidizing reagent. The dimer intermediate (see scheme) and isotopic labeling control experiments with 18O2 partially disclosed the reaction mec