- Min.Order :1 Kilogram
- Purity: 97.5% min.
- Payment Terms : L/C,T/T,Other
Keywords
Dicyandiamide DCD DCDA
Quick Details
- Appearance:Free flowing white powder.
- Application:Usage: 1. Micro-dicyandiamide can be used as One Component Adhesives 2. Micro-dicyandiamide can be used as Epoxy Powder Coatings 3. Micro-dicyandiamide can be used as Prepregs and Film Adhesive
- PackAge:25kg、500kg、1000kg poly woven bag, or other package.
- ProductionCapacity:400|Metric Ton|Month
- Storage:Store in a dry and well ventilated warehouse.
- Transportation:by sea, by courier, by air, by train.
Superiority:
Micro-Dicyandiamide
Molecular Formula: C2H4N4 Molecular Weight:84.08
CAS No.:461-58-5
Properties:：
Micro-Dicyandiamide is free flowing White powder.
Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
Micro-dicyandiamide is easily dispersed in liquid resins.
Specification:
|
Items |
Index |
|
Appearance |
Free Flowing White Powder |
|
Purity (%) |
97.5 min |
|
Free Water (%) |
0.3 max |
|
Melt Point (°C) |
209-212 |
|
Particle Size (98%)［µm］ |
10μm max |
|
Dispersant (%) |
1.5 max |
Usage:
1. Micro-dicyandiamide can be used as One Component Adhesives
2. Micro-dicyandiamide can be used as Epoxy Powder Coatings
3. Micro-dicyandiamide can be used as Prepregs and Film Adhesives
4.Micro-dicyandiamide can be used as Electronic Potting and Encapsulating Compounds
Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package.
Details:
Micro-Dicyandiamide
Molecular Formula: C2H4N4 Molecular Weight:84.08
CAS No.:461-58-5
Properties:：
Micro-Dicyandiamide is free flowing White powder.
Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
Micro-dicyandiamide is easily dispersed in liquid resins.
Specification:
|
Items |
Index |
|
Appearance |
Free Flowing White Powder |
|
Purity (%) |
97.5 min |
|
Free Water (%) |
0.3 max |
|
Melt Point (°C) |
209-212 |
|
Particle Size (98%)［µm］ |
10μm max |
|
Dispersant (%) |
1.5 max |
Usage:
1. Micro-dicyandiamide can be used as One Component Adhesives
2. Micro-dicyandiamide can be used as Epoxy Powder Coatings
3. Micro-dicyandiamide can be used as Prepregs and Film Adhesives
4.Micro-dicyandiamide can be used as Electronic Potting and Encapsulating Compounds
Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package.
You Might Also Like
Related Searches
About|Contact|Cas|Product Name|Molecular|Country|Encyclopedia
Message|New Cas|MSDS|Service|Advertisement|CAS DataBase|Article Data|Manufacturers | Chemical Catalog
©2008 LookChem.com,License: ICP
NO.:Zhejiang16009103
complaints:service@lookchem.com Desktop View