- Min.Order :1 Metric Ton
- Purity: 99.99%
- Payment Terms : L/C,D/A,D/P,T/T,MoneyGram,Other
Keywords
Tellurium Tellurium Supplier Supplier
Quick Details
- Appearance:silvery white
- Application:It is mainly used in manufacturing II-VI Compound semiconductor, solar cells, thermoelectric conversion devices, cooling devices, gas sensors, thermal sensors, pressure sensors, photosensors, piezoele
- PackAge:polyester film packaging, plastic film vacuum packaging or polyethylene bottle vacuum packaging.
- ProductionCapacity:1|Metric Ton|Day
- Storage:Sealed in dry,Room Temperature
- Transportation:According to the content of the contract
Superiority:
Product Introduction：
It is mainly used in manufacturing II-VI Compound semiconductor, solar cells, thermoelectric conversion devices, cooling devices, gas sensors, thermal sensors, pressure sensors, photosensors, piezoelectric crystals and nuclear radiation detection, infrared detectors and other basic materials.
Overview
Technology docking：Lead-zinc ore, copper ore anode slime-enrichment-electrolysis-vacuum distillation-hydrogen deoxidation-regional melting;
Inspection: icp-ms; laser particle size analyzer, sem。
Services: provide practical protective measures, provide material application solutions.
1、Physical properties：
Atomic weight：127.60
Electronegativity：2.1
Density：6.24 g/cm3
Melting Point：449.51 ℃
Melting Point：998 ℃
2、Specifications：
Chemical purity：
High purity tellurium：Te-05 The purity is over 99.999% ，Silver, aluminum, bismuth, calcium, chromium, copper, iron, magnesium, manganese, sodium, nickel, lead, selenium, silicon, tin, zinc, total impurities less than 10 ppm；
High purity tellurium：Te-06 The purity is over 99.999%，Silver, aluminum, bismuth, calcium, chromium, copper, iron, magnesium, manganese, sodium, nickel, lead, selenium, silicon, tin, zinc, total impurities less than 1 ppm；
Ultra-pure tellurium：Te-07 The purity is over 99.999%，Silver, aluminum, bismuth, calcium, chromium, copper, iron, magnesium, manganese, sodium, nickel, lead, selenium, silicon, tin, zinc, total impurities less than 0.1 ppm。
3、Physical properties: blocks, ingots, powders。
4、Purpose：
It is mainly used in manufacturing II-VI Compound semiconductor, solar cells, thermoelectric conversion devices, cooling devices, gas sensors, thermal sensors, pressure sensors, photosensors, piezoelectric crystals and nuclear radiation detection, infrared detectors and other basic materials。
5、Packaging: polyester film packaging, plastic film vacuum packaging or polyethylene bottle vacuum packaging.
Details:
Product Introduction：
It is mainly used in manufacturing II-VI Compound semiconductor, solar cells, thermoelectric conversion devices, cooling devices, gas sensors, thermal sensors, pressure sensors, photosensors, piezoelectric crystals and nuclear radiation detection, infrared detectors and other basic materials.
Overview
Technology docking：Lead-zinc ore, copper ore anode slime-enrichment-electrolysis-vacuum distillation-hydrogen deoxidation-regional melting;
Inspection: icp-ms; laser particle size analyzer, sem。
Services: provide practical protective measures, provide material application solutions.
1、Physical properties：
Atomic weight：127.60
Electronegativity：2.1
Density：6.24 g/cm3
Melting Point：449.51 ℃
Melting Point：998 ℃
2、Specifications：
Chemical purity：
High purity tellurium：Te-05 The purity is over 99.999% ，Silver, aluminum, bismuth, calcium, chromium, copper, iron, magnesium, manganese, sodium, nickel, lead, selenium, silicon, tin, zinc, total impurities less than 10 ppm；
High purity tellurium：Te-06 The purity is over 99.999%，Silver, aluminum, bismuth, calcium, chromium, copper, iron, magnesium, manganese, sodium, nickel, lead, selenium, silicon, tin, zinc, total impurities less than 1 ppm；
Ultra-pure tellurium：Te-07 The purity is over 99.999%，Silver, aluminum, bismuth, calcium, chromium, copper, iron, magnesium, manganese, sodium, nickel, lead, selenium, silicon, tin, zinc, total impurities less than 0.1 ppm。
3、Physical properties: blocks, ingots, powders。
4、Purpose：
It is mainly used in manufacturing II-VI Compound semiconductor, solar cells, thermoelectric conversion devices, cooling devices, gas sensors, thermal sensors, pressure sensors, photosensors, piezoelectric crystals and nuclear radiation detection, infrared detectors and other basic materials。
5、Packaging: polyester film packaging, plastic film vacuum packaging or polyethylene bottle vacuum packaging.
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