- Min.Order :1 Metric Ton
- Purity: 99.99%
- Payment Terms : L/C,D/A,D/P,T/T,Other
Keywords
tin High purity tin factory
Quick Details
- Appearance:Metal filiform
- Application:Mainly used for preparing group compound semiconductors (such as PbxSn1-xTe), high-purity alloys, ultra-low temperature cooling alloys, superconducting materials (Nb2Sn), solder, and dopants for compo
- PackAge: Polyester film packaging followed by plastic film vacuum packaging or glass tube vacuum packaging.
- ProductionCapacity:1|Metric Ton|Day
- Storage:no restrictions.
- Transportation:According to the content of the contract
Superiority:
Product Introduction：
6N tin, 99.9999% tin particles (Sn) 7440-31-5
High purity tin (Sn) Tin
Overview
Purpose:
Mainly used for preparing group compound semiconductors (such as PbxSn1-xTe), high-purity alloys, ultra-low temperature cooling alloys, superconducting materials (Nb2Sn), solder, and dopants for compound semiconductors. ITO materials and other basic materials.
Packaging: Polyester film packaging followed by plastic film vacuum packaging or glass tube vacuum packaging.
Technical Parameter
1. Physical properties:
Atomic mass: 118.69
Melting point: 232 ℃
Boiling point: 2260 ℃
Electronegativity: 1.8-1.9
Silver white metal; α.β.γ Three variants.
2. Specifications:
Chemical purity:
High purity tin: Sn-05 has a purity of over 99.999%, and the total impurity content of silver, aluminum, arsenic, gold, bismuth, calcium, cobalt, copper, iron, indium, magnesium, nickel, and zinc is less than 10ppm;
Ultra pure tin: Sn-06 has a purity of over 99.9999%, with a total impurity content of less than 1ppm in silver, aluminum, gold, calcium, cobalt, copper, iron, magnesium, nickel, and zinc;
3. Physical properties: rod, ingot, tablet, powder, granule, pill.
Details:
Product Introduction：
6N tin, 99.9999% tin particles (Sn) 7440-31-5
High purity tin (Sn) Tin
Overview
Purpose:
Mainly used for preparing group compound semiconductors (such as PbxSn1-xTe), high-purity alloys, ultra-low temperature cooling alloys, superconducting materials (Nb2Sn), solder, and dopants for compound semiconductors. ITO materials and other basic materials.
Packaging: Polyester film packaging followed by plastic film vacuum packaging or glass tube vacuum packaging.
Technical Parameter
1. Physical properties:
Atomic mass: 118.69
Melting point: 232 ℃
Boiling point: 2260 ℃
Electronegativity: 1.8-1.9
Silver white metal; α.β.γ Three variants.
2. Specifications:
Chemical purity:
High purity tin: Sn-05 has a purity of over 99.999%, and the total impurity content of silver, aluminum, arsenic, gold, bismuth, calcium, cobalt, copper, iron, indium, magnesium, nickel, and zinc is less than 10ppm;
Ultra pure tin: Sn-06 has a purity of over 99.9999%, with a total impurity content of less than 1ppm in silver, aluminum, gold, calcium, cobalt, copper, iron, magnesium, nickel, and zinc;
3. Physical properties: rod, ingot, tablet, powder, granule, pill.
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