- Min.Order :1 Metric Ton
- Purity: 99.99%
- Payment Terms : L/C,D/A,D/P,T/T,Other
Keywords
indium selenide 12056-07-4 factory
Quick Details
- Appearance: Soft black block or powder.
- Application:Mainly used as semiconductors, photoconductive materials, optical and electrical sensor components.
- PackAge:Polyethylene bottle packaging.
- ProductionCapacity:1|Metric Ton|Day
- Storage:
- Transportation:Based on customer needs
Superiority:
Product Introduction：
Indium(III) selenide (In2Se3)
1. Physical properties:
Atomic mass: 193.508
The deformed NaCl structure is black with a dull greasy luster and is fragile.
Melting point: 660 ℃
Density: 5.55 g/cm3
Overview
Indium(III) selenide (In2Se3)
1. Physical properties:
Atomic mass: 193.508
The deformed NaCl structure is black with a dull greasy luster and is fragile.
Melting point: 660 ℃
Density: 5.55 g/cm3
Technical Parameter
2. Specification:
Indium(III) selenide: The purity of In2Se3-05 is more than 99.999%, and the total content of silver, aluminum, cadmium, copper, iron, magnesium, nickel and aluminum impurities is less than 10ppm.
3. Physical properties: Soft black block or powder.
4. Purpose:
Mainly used as semiconductors, photoconductive materials, optical and electrical sensor components.
5. Packaging: Polyethylene bottle packaging.
Details:
Product Introduction：
Indium(III) selenide (In2Se3)
1. Physical properties:
Atomic mass: 193.508
The deformed NaCl structure is black with a dull greasy luster and is fragile.
Melting point: 660 ℃
Density: 5.55 g/cm3
Overview
Indium(III) selenide (In2Se3)
1. Physical properties:
Atomic mass: 193.508
The deformed NaCl structure is black with a dull greasy luster and is fragile.
Melting point: 660 ℃
Density: 5.55 g/cm3
Technical Parameter
2. Specification:
Indium(III) selenide: The purity of In2Se3-05 is more than 99.999%, and the total content of silver, aluminum, cadmium, copper, iron, magnesium, nickel and aluminum impurities is less than 10ppm.
3. Physical properties: Soft black block or powder.
4. Purpose:
Mainly used as semiconductors, photoconductive materials, optical and electrical sensor components.
5. Packaging: Polyethylene bottle packaging.
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