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25293-64-5 Epoxy resin S-186 Epoxy resin
ensity: 1.406 g/cm3 Melting Point: Boiling Point: 447.4 °C at 760 mmHg Flash Point: 200.6 °C
CAS NO.: 25293-64-5
Molecular structural formula:
Molecular formula: C14H18O7
Uses: Mainly used in coatings, composites material, adhesives, electronics industry.
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