Bis-(Sodium sulfopropyl)-disulfide (SP) (SPS) Intermediate for Copper plating 1) CAS NO. 27206-35-5 2) Molecular Weight 354.4 3) Mole…
Bis-(Sodium sulfopropyl)-disulfide (SP) (SPS) Intermediate for Copper plating 1) CAS NO. 27206-35-5 2) Molecular Weight 354.4 3) Molecular Formula C6H12O6S4Na2 4) Appearance White or yellowish powder 5) PH 3-7(38% water solution) 6) Application As a brightening agent for acid copper baths for decorative and functional deposits, it is functionally compatible with most components of typical copper bath formulation such as non-ionic surfactants, polymeric amines and other mercapto compounds 7)Package: 20Kg/drum
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