3-S-thiuronium propyl sulfonate (UPS) Intermediate for Copper plating 1) CAS NO. 21668-81-5 2) Molecular Weight 198.2 3) Molecular For…
3-S-thiuronium propyl sulfonate (UPS) Intermediate for Copper plating 1) CAS NO. 21668-81-5 2) Molecular Weight 198.2 3) Molecular Formula C4H10N2O3S2 4) Appearance White powder 5) Application Used for deposition of bright, ductile copper coatings in combination with polyethylene glycols and non-ionic surfactants. Also can be used in acid electroplating baths for silver and palladium deposition. 7)Package: 25Kg/drum
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