Add time:07/20/2019         Source:sciencedirect.com

Diketopyrrolopyrrole (DPP), as a brilliant functional organic pigments, is an excellent candidate to be used for leveler in copper electrodeposition. Herein, the DPP derivatives with different aryl substitutions are conveniently designed, synthesized and used as levelers in copper electrodeposition. The molecules based on DPP skeleton are investigated the structure-performance relationships by featuring aryl substitutions with different electronic properties. The results indicate that the aryl modification of DPP plays an important role in tunning the surface activity, interface adhesion and the interaction with copper surface. The admirable synergistic effect of CF3-DPP with bis-(3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG) leads to an excellent conformal copper deposition during practical electroplating. Theoretical calculations show that the aryl modification also tunes the molecular orbital energy level and adsorption energy of DPP toward copper surface. This work provides a guiding significance in the design of efficient dye-based levelers for microelectronics copper electrodeposition.

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