Add time:07/11/2019         Source:sciencedirect.com

Polyimides with a low dielectric constant and excellent adhesion were prepared from a diamine containing phosphine oxide and fluorine groups, bis(3,3′-aminophenyl-2,3,5,6-tetrafluoro-4-trifluoromethyl phenyl phosphine oxide (mDA7FPPO), and rigid-rod type dianhydride containing fluorine groups, such as 3,6-di(3′,5′-bis(trifluoromethyl)-phenyl)pyromellitic dianhydride (12FPMDA). The polyimides were synthesized via the known two-step process, preparation of poly(amic-acid) followed by solution imidization, and characterized by FT-IR, NMR, DSC, TGA and TMA. In addition, their solubility, intrinsic viscosity, dielectric constant and adhesive property were also evaluated. For comparison, 3,6-di(4′-trifluoromethylphenyl) pyromellitic dianhydride (6FPMDA) and 3,6-diphenylpyromellitic dianhydride (DPPMDA) were also utilized. The prepared polyimides exhibited high Tg (276–314 °C), excellent thermal stability (>500 °C in air), good adhesive property (104.7–126.3 g/mm), good solubility, and very low dielectric constant (2.34–2.89).

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