Add time:08/16/2019         Source:sciencedirect.com

Copper and hexagonal boron nitride filler (Cu/hBN) were incorporated into carbon fiber-reinforced polymer (CFRP) composites by electrophoretic deposition (EPD) to maximize their thermal conductivity. The results show that the thermal conductivity increased to 1.68 and 5.15 W/mK in the through-thickness and in-plane directions, respectively, when the concentration of hBN particles in the deposition solution was increased to 5 g/L. Moreover, the interlaminar shear strength results of various composites exhibited the same trend as the thermal conductivity. However, the tensile test results showed that the tensile strength was reduced as the hBN concentration was increased.

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