Add time:07/19/2019         Source:sciencedirect.com

A series of organo-soluble polyimides were prepared from a novel fluorinated diamine monomer, 4-phenyl-2,6-bis[4-(4′-amino-2′-trifluoromethylphenoxy)phenyl]pyridine and various commercial aromatic dianhydrides. These polyimides had good solubility in common organic solvents. The obtained strong and flexible PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) of above 561 °C and the glass transition temperature in the range of 258–312 °C. Moreover, the polymer films showed good electrical insulating property, low dielectric constant and low water uptake due to the introduction of fluorinated substitutes in the polymer backbone. The remarkable combined features ensure these polymers to be ideal candidate materials for advanced microelectronic industry and other related applications.

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