Details:
Epoxy resin curing agent 4, 4'-Diaminodiphenylsulfone (DDS)
English name: 4, 4'-Diaminodiphenylsulfone (DDS)
Other name: 4, 4'-Diaminodiphenyl sulfone; Dapsonum; Bis(4-aminophenyl)sulfone
Molecular Formula: C12H12N2O2S
Molecular Weight: 248.30
CAS No.: 80-08-0
EINECS No.: 201-248-4
Identification:
Chemical name: 4,4 '- diaminodiphenyl sulfone
Other names: dapsone; 4 - aminophenyl sulfone; diamino diphenyl sulfone; 4,4 '- diamino diphenyl sulfone
CAS Number: 80-08-0
Chemical Description:
Molecular formula: C12H12N2O2S
Molecular Weight: 248.30
Structure:
Description and Physical Properties:
Physical state: Solid (powder)
Solubility: soluble in methanol, ethanol, acetone and hydrochloric acid, insoluble in water
Quality Index:
Appearance: white crystal powder
Assay: 99.9% min.
Melting point: 175.0 ° C-181.0 ° C
Loss on drying: 0.2% max. (Enterprise standard)
Packing:25 kg / drum.
Uses:
A synthetic polysulfone amide resin and other polymers.
(2) Epoxy resin curing agent
3 Adhesive
4 gas chromatography stationary phase
5 anti-leprosy drugs
Mainly related to the above purposes aerospace industry, industrial laminates, insulation materials, textile equipment, pharmaceutical and other industries.
Handling and Storage:
Wash thoroughly after handling body. Remove contaminated clothing and wash before re-use. Avoid contact with eyes, skin and clothing, ingestion and inhalation.
Store in a cool, dry place. In Keep container closed when not in use.
Security Guide
Overview: irritant, may cause respiratory irritation, eating poisonous.
Toxicity: Acute oral, rat, LD50 = 1g/kg.