DOPOcontainsarigidphosphorusgroupandthusprovidebetterthermalandflame-retardantpropertiesthantheconventionalepoxyresinspreparedfromtetrabromobisphenolA…
DOPO contains a rigid phosphorus group and thus provide better thermal and flame-retardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.
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