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1 Kilogram |
FOB Price: USD 65.0000 |
dicopper hydroxide phosphate purity 99.1% Copper(II) hydroxide phosphate 9 laser marking additive for LDS
Product Description
The produced as a single-component injection mold using commercially available thermoplastics that contain additive from Puls 8840,8850.
A laser beam activates the thermoplastics material and creates metallic seeds through a physical-chemical reaction.In addition to activation,the laser beam inscribes the cricuit layout directly onto the plastic component. It forms a microrough surface onto which the copper is frimly anchored during the metallization phase.
Metallization of the component begins with a cleaning phase. For the next step, an additive track build-up takes place in acopper bath, typically in the range of 3 to 6 um/h. Finally, a deposition of nickel and a thin layer of gold generally occurs.Application-specific coatings such as tin,silver,palladium/gold and an organic solderability preservative(OSD) also can be applied during this process. The 3D MID is ready for assembly.
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