Add time:07/27/2019         Source:sciencedirect.com

In this study, the ternary Ni − Sn − P alloy coatings were prepared on the copper substrate by electroless deposition at a relatively low temperature of 50 °C with a relatively high deposition rate of 9.0 μm·h−1 from a neutral solution by using Sodium stannate (cas 12058-66-1) (Na2SnO3) as the tin source. The coating consisted of 96.02% Ni, 2.82% P, and 1.16% Sn. The effects of Na2SnO3 and other deposition parameters on the deposition rate were investigated. Electrochemical experiments were also carried out to reveal the mechanism of Na2SnO3 influencing the Ni − Sn − P deposition procedure. It was found Na2SnO3 inhibited the anodic oxidation of hypophosphite and accelerated the cathodic reduction of Ni2+ simultaneously. Furthermore, the activation energy of Ni − Sn − P deposition process was estimated to be 42.6 kJ·mol−1. The Ni − Sn − P alloy coating exhibited smoother surface and improved corrosion resistance compared with Ni − P coating.

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