Add time:09/24/2019 Source:sciencedirect.com
Poly(2-trimethylsilyl-2-propyl methacrylate) was synthesized and evaluated as a potential dry-developable chemically amplified photoresist. The deprotection of 2-trimethylsilyl-2-propyl group of the polymer takes place in the exposed region after post-exposure bake. The difference of silicon content between the unexposed region and exposed regions is large enough to form patterns using oxygen reactive-ion etching. The etching selectivity of the unexposed region to the exposed region was 142.
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