Product Name

  • Name

    copper(2+) bis[(acetyl{4-[(E)-2-phenylethenyl]phenyl}amino)oxidanide]

  • EINECS
  • CAS No. 63021-62-5
  • Density
  • Solubility
  • Melting Point
  • Formula C32H28N2O4•Cu
  • Boiling Point 439.8°C at 760 mmHg
  • Molecular Weight 568.16
  • Flash Point 219.8°C
  • Transport Information
  • Appearance
  • Safety Questionable carcinogen with experimental carcinogenic data. When heated to decomposition it emits toxic fumes of NOx. See also COPPER COMPOUNDS.
  • Risk Codes
  • Molecular Structure Molecular Structure of 63021-62-5 (copper(2+) bis[(acetyl{4-[(E)-2-phenylethenyl]phenyl}amino)oxidanide])
  • Hazard Symbols
  • Synonyms
  • PSA
  • LogP

trans-N-(p-Styrylphenyl)acetohydrox-amic acid, copper(2+) complex Chemical Properties

IUPAC Name: Copper N-oxido-N-[4-[(E)-2-phenylethenyl]phenyl]acetamide
Synonyms of trans-N-(p-Styrylphenyl)acetohydrox-amic acid, copper(2+) complex (CAS NO.63021-62-5) : Copper complex with trans-N-(p-styrylphenyl)acetohydroxamic acid ; trans-N-(p-Styrylphenyl)acetohydroxamic acid, copper(2+) complex ; trans-N-Hydroxy-4-acetylaminostilbene cupric chelate ; Acetohydroxamic acid, trans-N-(p-styrylphenyl)-, copper(2+) complex
InChI:InChI=1/2C16H14NO2.Cu/c2*1-13(18)17(19)16-11-9-15(10-12-16)8-7-14-5-3-2-4-6-14;/h2*2-12H,1H3;/q2*-1;+2/b2*8-7+;
CAS NO:63021-62-5
Molecular Formula:C32H28CuN2O4 
Molecular Weight :568.1217                  
Molecular Structure :
Flash Point:  219.8 °C 
Enthalpy of Vaporization:  73.44 kJ/mol 
Boiling Point:  439.8 °C at 760 mmHg 
Vapour Pressure:  1.64E-08 mmHg at 25°C

trans-N-(p-Styrylphenyl)acetohydrox-amic acid, copper(2+) complex Consensus Reports

Copper and its compounds are on the Community Right-To-Know List.

trans-N-(p-Styrylphenyl)acetohydrox-amic acid, copper(2+) complex Safety Profile

Questionable carcinogen with experimental carcinogenic data. When trans-N-(p-Styrylphenyl)acetohydrox-amic acid, copper(2+) complex (CAS NO.63021-62-5) is heated to decomposition ,it emits toxic fumes of NOx. See also COPPER COMPOUNDS.

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