Product Name

  • Name

    COPPER(I) SULFIDE

  • EINECS 244-842-9
  • CAS No. 22205-45-4
  • Article Data548
  • CAS DataBase
  • Density 5.6 g/mL at 25 °C(lit.)
  • Solubility Slightly soluble in hydrochloric acid, ammonium hydroxide. Insoluble in water.
  • Melting Point 1100 °C
  • Formula Cu2S
  • Boiling Point
  • Molecular Weight 159.158
  • Flash Point
  • Transport Information
  • Appearance
  • Safety 7-22-36/37/39
  • Risk Codes 20/21/22-40
  • Molecular Structure Molecular Structure of 22205-45-4 (COPPER(I) SULFIDE)
  • Hazard Symbols
  • Synonyms Cuprous sulfide;Cuprous sulfide (Cu2S);Dicopper monosulfide;Dicopper sulfide;
  • PSA 25.30000
  • LogP 0.64320

Synthetic route

Cu2Pt4S8

Cu2Pt4S8

A

sulfur
10544-50-0

sulfur

B

platinum(II) sulfide

platinum(II) sulfide

C

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
decompn. under argon at about 800 K;A 100%
B 100%
C 100%
pyrite

pyrite

copper(II) sulfate
7758-99-8

copper(II) sulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

iron(II) sulfate

iron(II) sulfate

Conditions
ConditionsYield
In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;;A 99.3%
B n/a
In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;;A 99.3%
B n/a
copper diacetate
142-71-2

copper diacetate

thiourea
17356-08-0

thiourea

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water for 1h; Sonication;91%
In ethanol Cu acatate and thiourea dissolved in abs.EtOH, stirred for 10 min, dip coated onto glass substrate, heated at 200°C for 10 min (several cycles), heated at 200°C for 60 min;
water
7732-18-5

water

copper(l) chloride

copper(l) chloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
With hydrogen sulfide In neat (no solvent) on passing over H2O-vapor at about 450°C in presence of excess H2S;;
carbon oxide sulfide
463-58-1

carbon oxide sulfide

copper(l) chloride

copper(l) chloride

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

carbon dioxide
124-38-9

carbon dioxide

Conditions
ConditionsYield
In hydrogenchloride complete decompn.;;
In hydrogenchloride complete decompn.;;
Conditions
ConditionsYield
In water quick react. with powdered Cu;
In water slow react. at room temp., fast react. on boiling;;
In water slow react. at room temp., fast react. on boiling;;
In neat (no solvent) heating in vac. to about 110°C;;
copper(II) nitrate

copper(II) nitrate

sodium thiosulfate

sodium thiosulfate

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water electroless thin film deposition from copper(II)/S2O3(2-) soln. (molar ratio Cu(II)/S2O3(2-)=1:2), pH ca. 5 (acetic acid), bath temp. 50°C;; rinsed with water, air dried; Rutherford back scattering anal., scanning electron microscopy, X-ray diffraction;
copper(II) chloride pentahydrate

copper(II) chloride pentahydrate

sodium thiosulfate

sodium thiosulfate

N,N-dimethylthiourea
534-13-4

N,N-dimethylthiourea

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water aq. soln. of CuCl2*5H2O, dimethylthiourea and Na2S2O3 prepd. in deionized H2O, mixed, pH=2.3 at 70 °C, deposition time 3.5 h;
copper(II) ion

copper(II) ion

sodium thiosulfate

sodium thiosulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

copper(II) sulfide

copper(II) sulfide

C

sulfur
7704-34-9

sulfur

Conditions
ConditionsYield
In water on boiling, excess Na2S2O3; product ratio depending on react. time, Na2S2O3 concn., acidity of soln.;;
In water on boiling, excess Na2S2O3; product ratio depending on react. time, Na2S2O3 concn., acidity of soln.;;
copper(II) ion

copper(II) ion

sodium thiosulfate

sodium thiosulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

sulfur
7704-34-9

sulfur

Conditions
ConditionsYield
In water on boiling, excess Na2S2O3;;A >99
B n/a
In water on boiling, excess Na2S2O3;;A >99
B n/a
copper(II) sulfate
7758-99-8

copper(II) sulfate

sodium thiosulfate

sodium thiosulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

copper(II) sulfide

copper(II) sulfide

C

sulfur
7704-34-9

sulfur

Conditions
ConditionsYield
In water heating with excess Na2S2O3 in a closed tube to 140-200°C;;
In water heating with excess Na2S2O3 in a closed tube to 140-200°C;;
copper(II) sulfate
7758-99-8

copper(II) sulfate

sodium thiosulfate

sodium thiosulfate

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water electroless thin film deposition from copper(II)/S2O3(2-) soln. (molar ratio Cu(II)/S2O3(2-)=1:2), pH ca. 5 (acetic acid), bath temp. 50°C;; film rinsed with water, air dried; Rutherford back scattering anal., scanning electron microscopy, X-ray diffraction;
sodium thiosulfate

sodium thiosulfate

copper dichloride

copper dichloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In melt on melting;;
In melt on melting;;
copper(I) oxide

copper(I) oxide

sodium thiosulfate

sodium thiosulfate

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In not given sol. in Na2S2O3 soln; on heating pptn. of Cu2O and Cu2S;;
In not given sol. in Na2S2O3 soln; on heating pptn. of Cu2O and Cu2S;;
Conditions
ConditionsYield
In neat (no solvent) at elevated temperature with pure CS2-vapor or in mixture with CO2 or N2;;
In neat (no solvent) with CS2 vapor or with CS2 vapor with CO2 or N2 at elevated temp.;;
In neat (no solvent) with CS2 vapor or with CS2 vapor with CO2 or N2 at elevated temp.;;
In neat (no solvent) with CS2 contg. CO2 at elevated temp., heating to 860°C in vac.;; 99.8% Cu2S;;
In neat (no solvent) with CS2 contg. CO2 at elevated temp., heating to 860°C in vac.;; 99.8% Cu2S;;
iron sulfide

iron sulfide

silica copper(I) oxide

silica copper(I) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In neat (no solvent) byproducts: FeSiO3; at 1800°C;;
In neat (no solvent) byproducts: FeSiO3; at 1800°C;;
copper(I) oxide

copper(I) oxide

iron sulfide

iron sulfide

A

iron(II) oxide
1345-25-1

iron(II) oxide

B

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In melt
barium sulfide

barium sulfide

copper(l) chloride

copper(l) chloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(I) bromide
7787-70-4

copper(I) bromide

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
With H2S In acetonitrile
cadmium(II) sulphide

cadmium(II) sulphide

copper(II) sulfate
7758-99-8

copper(II) sulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

digenite

digenite

C

Cu1.90S

Cu1.90S

Conditions
ConditionsYield
With potassium nitrate In melt Cd-salt subjecting to electrostimulated ion exchange in melt of K-salt, residue treatment in melt of Cu-salt, according to V. A. Fedorov et al.,Phys. Status Solidi A 139 (1993) 9;
copper(l) chloride

copper(l) chloride

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

copper dichloride

copper dichloride

Conditions
ConditionsYield
With sulfur dioxide In hydrogenchloride in dild- HCl-soln.;;
With SO2 In hydrogenchloride in dild- HCl-soln.;;
copper(l) chloride

copper(l) chloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
With sodium dithionite In water
With hydrogen sulfide In hydrogenchloride pptn.;;
With hydrogenchloride; sulfur dioxide In hydrogenchloride 5 - 15 wt.-% HCl soln.;;
copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(I) oxide

copper(I) oxide

Conditions
ConditionsYield
With oxygen In neat (no solvent) at 700°C, O2-N2-mixtures with 10 or 0% O2, 72 or 28min.;;98%
With O2 In neat (no solvent) at 700°C, O2-N2-mixtures with 10 or 0% O2, 72 or 28min.;;98%
With oxygen byproducts: SO2; heat of the reaction is given;
copper(I) sulfide
22205-45-4

copper(I) sulfide

sulfur
7704-34-9

sulfur

hydrazine
302-01-2

hydrazine

NH2NH3(1+)*NH2NH2*Cu7S4(1-)=N4H9Cu7S4

NH2NH3(1+)*NH2NH2*Cu7S4(1-)=N4H9Cu7S4

Conditions
ConditionsYield
In neat (no solvent) in inert atm. Cu2S and S were stirred at room temp. with hydrazine in sealed vial for 90 h; soln. was filtered and evapd. under N2 flow; elem. anal.;89%
for 48h;
calcium(II) sulfide

calcium(II) sulfide

copper(I) sulfide
22205-45-4

copper(I) sulfide

erbium(III) sulfide

erbium(III) sulfide

potassium bromide
7558-02-3

potassium bromide

KCaEr2CuS5

KCaEr2CuS5

Conditions
ConditionsYield
In melt (N2); mixt. of Cu2S, Er2S3, CaS (molar ratio = 1:2:3) and excess of KBr flux heated at 1000°C in Al2O3-crucible placed in evacuated silica tube for 180 h, slow cooling to 700°C over 90 h; washing with water at room temp.;65%
gadolinium

gadolinium

copper(I) sulfide
22205-45-4

copper(I) sulfide

sulfur
7704-34-9

sulfur

Cu2Gd0.67S2

Cu2Gd0.67S2

Conditions
ConditionsYield
With iodine In neat (no solvent, solid phase) Cu2S, Gd, S and I2 were kept for 2 wks under temp. gradient from 1173 Kto 1073 K;60%
copper(I) sulfide
22205-45-4

copper(I) sulfide

A

copper(I) oxide

copper(I) oxide

B

copper(II) sulfate
7758-99-8

copper(II) sulfate

Conditions
ConditionsYield
With oxygen In neat (no solvent) byproducts: SO2; at 500°C, O2-N2-mixtures with up to 60% O2;;A 50%
B n/a
With O2 In neat (no solvent) byproducts: SO2; at 500°C, O2-N2-mixtures with up to 60% O2;;A 50%
B n/a
With oxygen byproducts: SO2; over 500°C;
silver sulfide

silver sulfide

copper(I) sulfide
22205-45-4

copper(I) sulfide

stromeyerite

stromeyerite

Conditions
ConditionsYield
at room temp.; 48h;;45%
at room temp.; 24h;;24%
at room temp.; 12h;;15%
copper(I) sulfide
22205-45-4

copper(I) sulfide

A

sulfur
7704-34-9

sulfur

B

copper(l) chloride

copper(l) chloride

Conditions
ConditionsYield
With chlorine In neat (no solvent) at 100-300°C;;A n/a
B 30%
With iron(III) chloride byproducts: FeCl2;
With chlorine In neat (no solvent) at 400°C;;A n/a
B >99
calcium(II) sulfide

calcium(II) sulfide

copper(I) sulfide
22205-45-4

copper(I) sulfide

uranium(IV) sulfide

uranium(IV) sulfide

potassium bromide
7558-02-3

potassium bromide

KCuUS3

KCuUS3

Conditions
ConditionsYield
In neat (no solvent, solid phase) US2, Cu2S mixed, loaded in silica tube, sealed under 1E-4 Torr, heated at 1273 K for 10 d, mixed with CaS and KBr, ground, sealed, heated to 1123 K in 60 h, kept at 1123 K for 240 h, slowly cooled at 3 K/h to 853 K; washed with H2O, dried with acetone;10%
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

sodium chloride
7647-14-5

sodium chloride

copper dichloride

copper dichloride

Conditions
ConditionsYield
byproducts: Na2SO4; information about the react. eqs. in detail;
byproducts: Na2SO4; information about the react. eqs. in detail;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(II) oxide

copper(II) oxide

Sulfate
14808-79-8

Sulfate

Conditions
ConditionsYield
With chlorine; sulfur increased SO4(2-) prodn. between 100 and 300°C; SO4(2-) detn. in aq. extract;
With chlorine between 100 and 300°C almost entirely SO4(2-) prodn.; SO4(2-) detn. in aq. extract;
With chlorine between 100 and 300°C almost entirely SO4(2-) prodn.; SO4(2-) detn. in aq. extract;
With chlorine; sulfur increased SO4(2-) prodn. between 100 and 300°C; SO4(2-) detn. in aq. extract;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(II) sulfate
7758-99-8

copper(II) sulfate

Sulfate
14808-79-8

Sulfate

Conditions
ConditionsYield
With chlorine between 100 and 300°C, react. at 300°C also; SO4(2-) detn. in aq. extract;
With chlorine between 100 and 300°C, react. at 300°C also; SO4(2-) detn. in aq. extract;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

A

copper(I) oxide

copper(I) oxide

B

iron(II) oxide
1345-25-1

iron(II) oxide

C

iron(III) sulfate

iron(III) sulfate

D

copper(II) ferrite

copper(II) ferrite

E

copper(II) oxide

copper(II) oxide

Conditions
ConditionsYield
With air byproducts: SO2, SO3; mixing of Fe2O3 and Cu2S (1:1) mech. before roasting; information about the react. eqs. in detail, about dependence on temp. from 300 till 550°C and about the effect of Fe2O3; further products;
With air byproducts: SO2, SO3; mixing of Fe2O3 and Cu2S (1:1) mech. before roasting; information about the react. eqs. in detail, about dependence on temp. from 300 till 550°C and about the effect of Fe2O3; further products;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

A

copper(I) oxide

copper(I) oxide

B

iron(II) oxide
1345-25-1

iron(II) oxide

C

copper(II) ferrite

copper(II) ferrite

D

copper(II) oxide

copper(II) oxide

Conditions
ConditionsYield
byproducts: SO2, SO3; at roasting of Cu2S in presence of Fe2O3;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

sulfur dioxide
7446-09-5

sulfur dioxide

Conditions
ConditionsYield
In neat (no solvent) Kinetics; kinetics and statics described;; generation of SO2;;
manganese(III) oxide

manganese(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

manganese oxide

manganese oxide

Conditions
ConditionsYield
In neat (no solvent) byproducts: Cu, SO2; react. at 700 °C;;
In neat (no solvent) byproducts: Cu, SO2; react. at 700 °C;;
Conditions
ConditionsYield
With NH3; C In ammonia aq. NH3; Cu2S nanowires on copper grids with or without carbon coating washed with HCl for ca. 20 min, then by H2O and then immersed into aq. NH3 for 2 h; samples of Cu(OH)2 nanobelts washed with H2O, dried (air);
Conditions
ConditionsYield
In neat (no solvent) byproducts: SO2, H2; at light red heat;;
In neat (no solvent) byproducts: SO2, H2; at light red heat;;
In neat (no solvent) byproducts: H2S, H2, sulphur; weak react. at red heat, violent react. at white heat;;
copper(I) sulfide
22205-45-4

copper(I) sulfide

water
7732-18-5

water

copper(I) oxide

copper(I) oxide

Conditions
ConditionsYield
In neat (no solvent) on heating;;
In neat (no solvent) on heating;;

Copper(i) sulfide Consensus Reports

Copper and its compounds are on the Community Right-To-Know List. Reported in EPA TSCA Inventory. EPA Genetic Toxicology Program.

Copper(i) sulfide Standards and Recommendations

ACGIH TLV: TWA (fume) 0.2 mg/m3; (dust, mist) 1 mg(Cu)/m3

Copper(i) sulfide Specification

The Copper(i) sulfide, with its cas registry number 13494-80-9 powder, has the product categories which are Inorganics; Chalcogenides; Materials Science; Metal and Ceramic Science.

The characteristics of this chemical are as follows: (1)#H bond acceptors: 0; (2)#H bond donors: 0; (3)#Freely Rotating Bonds: 0; (4)Polar Surface Area: 0; (5)Enthalpy of Vaporization: 18.67 kJ/mol; (6)Vapour Pressure: 12600 mmHg at 25°C; (7)Exact Mass: 157.831273; (8)MonoIsotopic Mass: 157.831273; (9)Topological Polar Surface Area: 1; (10)Heavy Atom Count: 3.

When you are dealing with this chemical, you should be very careful. It is harmful if by inhalation, in contact with skin and if swallowed and may have limited evidence of a carcinogenic effect. Therefore, you should wear suitable protective clothing, gloves and eye/face protection. Then keep container tightly closed. Do remember not to breathe dust.

Additionally, you could convert the following datas into the molecular structure:
(1)Canonical SMILES: [S-2].[Cu+].[Cu+]
(2)InChI: InChI=1S/2Cu.S/q2*+1;-2
(3)InChIKey: AQMRBJNRFUQADD-UHFFFAOYSA-N 

Post buying leads

About|Contact|Cas|Product Name|Molecular|Country|Encyclopedia

Message|New Cas|MSDS|Service|Advertisement|CAS DataBase|Article Data|Manufacturers | Chemical Catalog

©2008 LookChem.com,License: ICP

NO.:Zhejiang16009103

complaints:service@lookchem.com Desktop View