Conditions | Yield |
---|---|
decompn. under argon at about 800 K; | A 100% B 100% C 100% |
Conditions | Yield |
---|---|
In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;; | A 99.3% B n/a |
In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;; | A 99.3% B n/a |
Conditions | Yield |
---|---|
In water for 1h; Sonication; | 91% |
In ethanol Cu acatate and thiourea dissolved in abs.EtOH, stirred for 10 min, dip coated onto glass substrate, heated at 200°C for 10 min (several cycles), heated at 200°C for 60 min; |
copper
copper(I) sulfide
Conditions | Yield |
---|---|
In neat (no solvent) annealing with Cu-filings;; | |
In neat (no solvent) annealing with Cu-filings;; |
Conditions | Yield |
---|---|
With hydrogen sulfide In neat (no solvent) on passing over H2O-vapor at about 450°C in presence of excess H2S;; |
Conditions | Yield |
---|---|
In hydrogenchloride complete decompn.;; | |
In hydrogenchloride complete decompn.;; |
copper
A
copper(I) sulfide
B
sodium sulfite
Conditions | Yield |
---|---|
In water at boiling; |
copper
copper(I) sulfide
Conditions | Yield |
---|---|
In water quick react. with powdered Cu; | |
In water slow react. at room temp., fast react. on boiling;; | |
In water slow react. at room temp., fast react. on boiling;; | |
In neat (no solvent) heating in vac. to about 110°C;; |
Conditions | Yield |
---|---|
In water electroless thin film deposition from copper(II)/S2O3(2-) soln. (molar ratio Cu(II)/S2O3(2-)=1:2), pH ca. 5 (acetic acid), bath temp. 50°C;; rinsed with water, air dried; Rutherford back scattering anal., scanning electron microscopy, X-ray diffraction; |
N,N-dimethylthiourea
copper(I) sulfide
Conditions | Yield |
---|---|
In water aq. soln. of CuCl2*5H2O, dimethylthiourea and Na2S2O3 prepd. in deionized H2O, mixed, pH=2.3 at 70 °C, deposition time 3.5 h; |
A
copper(I) sulfide
C
sulfur
Conditions | Yield |
---|---|
In water on boiling, excess Na2S2O3; product ratio depending on react. time, Na2S2O3 concn., acidity of soln.;; | |
In water on boiling, excess Na2S2O3; product ratio depending on react. time, Na2S2O3 concn., acidity of soln.;; |
Conditions | Yield |
---|---|
In water on boiling, excess Na2S2O3;; | A >99 B n/a |
In water on boiling, excess Na2S2O3;; | A >99 B n/a |
Conditions | Yield |
---|---|
In water heating with excess Na2S2O3 in a closed tube to 140-200°C;; | |
In water heating with excess Na2S2O3 in a closed tube to 140-200°C;; |
Conditions | Yield |
---|---|
In water electroless thin film deposition from copper(II)/S2O3(2-) soln. (molar ratio Cu(II)/S2O3(2-)=1:2), pH ca. 5 (acetic acid), bath temp. 50°C;; film rinsed with water, air dried; Rutherford back scattering anal., scanning electron microscopy, X-ray diffraction; |
Conditions | Yield |
---|---|
In melt on melting;; | |
In melt on melting;; |
Conditions | Yield |
---|---|
In not given sol. in Na2S2O3 soln; on heating pptn. of Cu2O and Cu2S;; | |
In not given sol. in Na2S2O3 soln; on heating pptn. of Cu2O and Cu2S;; |
carbon disulfide
copper
copper(I) sulfide
Conditions | Yield |
---|---|
In neat (no solvent) at elevated temperature with pure CS2-vapor or in mixture with CO2 or N2;; | |
In neat (no solvent) with CS2 vapor or with CS2 vapor with CO2 or N2 at elevated temp.;; | |
In neat (no solvent) with CS2 vapor or with CS2 vapor with CO2 or N2 at elevated temp.;; | |
In neat (no solvent) with CS2 contg. CO2 at elevated temp., heating to 860°C in vac.;; 99.8% Cu2S;; | |
In neat (no solvent) with CS2 contg. CO2 at elevated temp., heating to 860°C in vac.;; 99.8% Cu2S;; |
copper
A
iron(II) oxide
B
copper(I) sulfide
copper
A
copper(I) sulfide
B
iron
Conditions | Yield |
---|---|
In neat (no solvent) byproducts: FeSiO3; at 1800°C;; | |
In neat (no solvent) byproducts: FeSiO3; at 1800°C;; |
Conditions | Yield |
---|---|
In melt |
copper(I) bromide
copper(I) sulfide
Conditions | Yield |
---|---|
With H2S In acetonitrile |
copper
copper(I) sulfide
Conditions | Yield |
---|---|
Cu coat on iron; glowing at higher temp.; wrenching off the arising Cu2S layer; | |
Cu coat on iron; glowing at higher temp.; wrenching off the arising Cu2S layer; |
copper
A
copper(I) sulfide
B
cadmium
Conditions | Yield |
---|---|
reversible reaction; equil.; |
copper(II) sulfate
A
copper(I) sulfide
Conditions | Yield |
---|---|
With potassium nitrate In melt Cd-salt subjecting to electrostimulated ion exchange in melt of K-salt, residue treatment in melt of Cu-salt, according to V. A. Fedorov et al.,Phys. Status Solidi A 139 (1993) 9; |
Conditions | Yield |
---|---|
With sulfur dioxide In hydrogenchloride in dild- HCl-soln.;; | |
With SO2 In hydrogenchloride in dild- HCl-soln.;; |
copper(I) sulfide
Conditions | Yield |
---|---|
With sodium dithionite In water | |
With hydrogen sulfide In hydrogenchloride pptn.;; | |
With hydrogenchloride; sulfur dioxide In hydrogenchloride 5 - 15 wt.-% HCl soln.;; |
copper(I) sulfide
Conditions | Yield |
---|---|
With oxygen In neat (no solvent) at 700°C, O2-N2-mixtures with 10 or 0% O2, 72 or 28min.;; | 98% |
With O2 In neat (no solvent) at 700°C, O2-N2-mixtures with 10 or 0% O2, 72 or 28min.;; | 98% |
With oxygen byproducts: SO2; heat of the reaction is given; |
Conditions | Yield |
---|---|
In neat (no solvent) in inert atm. Cu2S and S were stirred at room temp. with hydrazine in sealed vial for 90 h; soln. was filtered and evapd. under N2 flow; elem. anal.; | 89% |
for 48h; |
copper(I) sulfide
potassium bromide
Conditions | Yield |
---|---|
In melt (N2); mixt. of Cu2S, Er2S3, CaS (molar ratio = 1:2:3) and excess of KBr flux heated at 1000°C in Al2O3-crucible placed in evacuated silica tube for 180 h, slow cooling to 700°C over 90 h; washing with water at room temp.; | 65% |
Conditions | Yield |
---|---|
With iodine In neat (no solvent, solid phase) Cu2S, Gd, S and I2 were kept for 2 wks under temp. gradient from 1173 Kto 1073 K; | 60% |
Conditions | Yield |
---|---|
With oxygen In neat (no solvent) byproducts: SO2; at 500°C, O2-N2-mixtures with up to 60% O2;; | A 50% B n/a |
With O2 In neat (no solvent) byproducts: SO2; at 500°C, O2-N2-mixtures with up to 60% O2;; | A 50% B n/a |
With oxygen byproducts: SO2; over 500°C; |
Conditions | Yield |
---|---|
at room temp.; 48h;; | 45% |
at room temp.; 24h;; | 24% |
at room temp.; 12h;; | 15% |
Conditions | Yield |
---|---|
With chlorine In neat (no solvent) at 100-300°C;; | A n/a B 30% |
With iron(III) chloride byproducts: FeCl2; | |
With chlorine In neat (no solvent) at 400°C;; | A n/a B >99 |
copper(I) sulfide
potassium bromide
Conditions | Yield |
---|---|
In neat (no solvent, solid phase) US2, Cu2S mixed, loaded in silica tube, sealed under 1E-4 Torr, heated at 1273 K for 10 d, mixed with CaS and KBr, ground, sealed, heated to 1123 K in 60 h, kept at 1123 K for 240 h, slowly cooled at 3 K/h to 853 K; washed with H2O, dried with acetone; | 10% |
Conditions | Yield |
---|---|
byproducts: Na2SO4; information about the react. eqs. in detail; | |
byproducts: Na2SO4; information about the react. eqs. in detail; |
Conditions | Yield |
---|---|
With chlorine; sulfur increased SO4(2-) prodn. between 100 and 300°C; SO4(2-) detn. in aq. extract; | |
With chlorine between 100 and 300°C almost entirely SO4(2-) prodn.; SO4(2-) detn. in aq. extract; | |
With chlorine between 100 and 300°C almost entirely SO4(2-) prodn.; SO4(2-) detn. in aq. extract; | |
With chlorine; sulfur increased SO4(2-) prodn. between 100 and 300°C; SO4(2-) detn. in aq. extract; |
Conditions | Yield |
---|---|
With chlorine between 100 and 300°C, react. at 300°C also; SO4(2-) detn. in aq. extract; | |
With chlorine between 100 and 300°C, react. at 300°C also; SO4(2-) detn. in aq. extract; |
copper(I) sulfide
B
iron(II) oxide
Conditions | Yield |
---|---|
With air byproducts: SO2, SO3; mixing of Fe2O3 and Cu2S (1:1) mech. before roasting; information about the react. eqs. in detail, about dependence on temp. from 300 till 550°C and about the effect of Fe2O3; further products; | |
With air byproducts: SO2, SO3; mixing of Fe2O3 and Cu2S (1:1) mech. before roasting; information about the react. eqs. in detail, about dependence on temp. from 300 till 550°C and about the effect of Fe2O3; further products; |
copper(I) sulfide
B
iron(II) oxide
Conditions | Yield |
---|---|
byproducts: SO2, SO3; at roasting of Cu2S in presence of Fe2O3; |
Conditions | Yield |
---|---|
In neat (no solvent) Kinetics; kinetics and statics described;; generation of SO2;; |
copper(I) sulfide
B
copper
Conditions | Yield |
---|---|
byproducts: SO2; | |
byproducts: SO2; |
Conditions | Yield |
---|---|
In neat (no solvent) byproducts: Cu, SO2; react. at 700 °C;; | |
In neat (no solvent) byproducts: Cu, SO2; react. at 700 °C;; |
copper(I) sulfide
B
copper
Conditions | Yield |
---|---|
byproducts: SO2; | |
byproducts: SO2; |
copper(I) sulfide
water
copper
copper hydroxide
Conditions | Yield |
---|---|
With NH3; C In ammonia aq. NH3; Cu2S nanowires on copper grids with or without carbon coating washed with HCl for ca. 20 min, then by H2O and then immersed into aq. NH3 for 2 h; samples of Cu(OH)2 nanobelts washed with H2O, dried (air); |
copper(I) sulfide
water
copper
Conditions | Yield |
---|---|
In neat (no solvent) byproducts: SO2, H2; at light red heat;; | |
In neat (no solvent) byproducts: SO2, H2; at light red heat;; | |
In neat (no solvent) byproducts: H2S, H2, sulphur; weak react. at red heat, violent react. at white heat;; |
Conditions | Yield |
---|---|
In neat (no solvent) on heating;; | |
In neat (no solvent) on heating;; |
Copper and its compounds are on the Community Right-To-Know List. Reported in EPA TSCA Inventory. EPA Genetic Toxicology Program.
ACGIH TLV: TWA (fume) 0.2 mg/m3; (dust, mist) 1 mg(Cu)/m3
The Copper(i) sulfide, with its cas registry number 13494-80-9 powder, has the product categories which are Inorganics; Chalcogenides; Materials Science; Metal and Ceramic Science.
The characteristics of this chemical are as follows: (1)#H bond acceptors: 0; (2)#H bond donors: 0; (3)#Freely Rotating Bonds: 0; (4)Polar Surface Area: 0; (5)Enthalpy of Vaporization: 18.67 kJ/mol; (6)Vapour Pressure: 12600 mmHg at 25°C; (7)Exact Mass: 157.831273; (8)MonoIsotopic Mass: 157.831273; (9)Topological Polar Surface Area: 1; (10)Heavy Atom Count: 3.
When you are dealing with this chemical, you should be very careful. It is harmful if by inhalation, in contact with skin and if swallowed and may have limited evidence of a carcinogenic effect. Therefore, you should wear suitable protective clothing, gloves and eye/face protection. Then keep container tightly closed. Do remember not to breathe dust.
Additionally, you could convert the following datas into the molecular structure:
(1)Canonical SMILES: [S-2].[Cu+].[Cu+]
(2)InChI: InChI=1S/2Cu.S/q2*+1;-2
(3)InChIKey: AQMRBJNRFUQADD-UHFFFAOYSA-N
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