Gallium trichloride
A
gallium
B
gallium trichloride-pyridine (1/1)
Conditions | Yield |
---|---|
In toluene inert atmosphere; soln. of Si-compd. cooled to -80°C, addn. of GaCl3 (equiv. amt.) soln., warming to room temp., Gallium pptn. on standing (3-5 d), filtration of Ga, pptn. on pyridine addn. to filtrate; filtration; | A 98% B 87% |
gallium(III) bromide
A
gallium
Conditions | Yield |
---|---|
In toluene inert atmosphere; soln. of Si-compd. cooled to -80°C, addn. of GaBr3 (equiv. amt.) soln., warming to room temp., gallium pptn. on standing (3-5 d), filtration of Ga, pptn. on pyridine addn. to filtrate; filtration; | A 96% B 79% |
IMes*GaH3
A
gallium
B
GaHBr2(1,3-bis(2,4,6-trimethylphenyl)imidazol-2-ylidene)GaHBr2(1,3-bis(2,4,6-trimethylphenyl)imidazol-2-ylidene)
Conditions | Yield |
---|---|
In toluene (under Ar, Schlenk); soln. of Ga-complex added dropwise to soln. of Ga-complex in toluene with stirring at room temp., heated to 50°C for36 h; filtered, volatiles removed in vacuo; | A n/a B 71% |
ephedrine hydrochloride
A
gallium
Conditions | Yield |
---|---|
With ammonium hydroxide In methanol for 3h; pH=8 - 9; Reflux; | A n/a B 66% |
gallium
Conditions | Yield |
---|---|
With 2,3,5,6-tetramethyl-1,4-bis(trimethylsilyl)-1,4-diaza-2,5-cyclo-hexadiene In tetrahydrofuran at 20℃; for 15h; Inert atmosphere; | 59% |
Conditions | Yield |
---|---|
In benzene byproducts: LiCl; addn. of soln. of carborane to GaCl3 (C6H6, 0°C), stirring at room temp. overnight; filtration off of LiCl and Ga, concn.; elem. anal.; | A n/a B 51% |
[LiAs(SiMe3)2*DME]
A
gallium
B
bis(1,4-di-t-butyl-1,4-diazabuta-1,3-diene)gallium
Conditions | Yield |
---|---|
In diethyl ether under Ar atm. to soln. Ga complex in Et2O LiAs(SiMe3)2*DME in Et2O (1:2)was added at -78°C over 5 min, soln. was warmed to room temp. an d stirred overnight; volatiles were emoved in vacuo, residue was extd. with hexane, filtered,concd., and cooled to -30°C overnight; elem. anal.; | A n/a B n/a C 33% |
A
gallium
C
gallane
Conditions | Yield |
---|---|
With octane byproducts: H2; at -30°C in vac. (<1E-4 mm Hg); Gallane condenses as a white solid, elem. anal.; | A n/a B n/a C 5% |
With octane In solid byproducts: H2; at -30°C in vac. (<1E-4 mm Hg); Gallane condenses as a white solid, elem. anal.; | A n/a B n/a C 5% |
Conditions | Yield |
---|---|
In water byproducts: H(1+); Sonication; Ar atmosphere (1.5 atm); 100 W/cm**2, 20-kHz, room temp., 90 min - 6 h; washing (H2O, 4 times), drying (vac.); detd. by powder X-ray diffraction; | A 1% B n/a |
1,1,3,3-tetramethylgyanidine-gallane (1/1)
A
gallium
B
hydrogen
C
N,N,N',N'-tetramethylguanidine
Conditions | Yield |
---|---|
at 85 - 90℃; Thermodynamic data; |
gallium
Conditions | Yield |
---|---|
With filter paper coal In neat (no solvent) annealing; | |
With hydrogen In neat (no solvent) in H2-stream at red heat;; | |
With filter paper coal In neat (no solvent) annealing; | |
With H2 In neat (no solvent) in H2-stream at red heat;; |
diborane
trimethyl gallium
A
gallium
B
methyl diboranemethyl diborane
C
hydrogen
Conditions | Yield |
---|---|
at room temp. with excess of B2H6; | |
at room temp. with excess of B2H6; |
Conditions | Yield |
---|---|
In solid at 580-650°C; UPS; Auger spect.; |
gallium
Conditions | Yield |
---|---|
In neat (no solvent) heated at 585 - 750 °C for 3 - 8 min under vac.; |
Conditions | Yield |
---|---|
In gaseous matrix Kinetics; Irradiation (UV/VIS); photolysis at 403.3 nm; KrF laser; carrier gas H2, D2 or CH4; monitoring fluorescence at 417.2 nm; | |
In neat (no solvent) deposition of Ga droplets on heated Si substrate (480 °C) at moleflow of GaMe3 of 2.2E-5 mol/min for 30 s; | |
In neat (no solvent) thermal decompn. on heated Cu or GaAs surfaces; detn. by MPI/MS; |
trimethyl gallium
A
gallium
B
monomethyl gallium
C
dimethylgallium
Conditions | Yield |
---|---|
In gas byproducts: CH3, C2H6; Irradiation (UV/VIS); laser photolysis; | |
In gas byproducts: C2H6, CH3; Irradiation (UV/VIS); photolysis (190-310 nm); studied by laser mass spectrometry and UV absorption spectrometry; |
Conditions | Yield |
---|---|
0% |
Conditions | Yield |
---|---|
0% |
Conditions | Yield |
---|---|
In neat (no solvent) High Pressure; under Ar flow; Si wafer placed on Al plate; Ga droplets (obtained from GaN at 1150°C) transferred by Ar contg. O2 (7.8 Torr partial pressure) and deposited onto Si wafer; heated at 1150°C (400 Torr) for5 h; detd. by scanning and transmission electron microscopy, and energy dispersive X-ray spectroscopy; | A n/a B 0% C 0% |
Gallium trichloride
gallium
Conditions | Yield |
---|---|
With arsenic(III) trioxide In water Electrochem. Process; electrodeposition, pH 14 (silicon substrate, -2.99 V vs Ag/AgCl,lead substrate, -1.73 V vs Ag/AgCl ); X-ray diffraction, Auger electron spectroscopy; | |
With potassium hydroxide In potassium hydroxide Electrolysis; | |
With LiBH(CH2CH3)3 In tetrahydrofuran byproducts: LiCl; (Ar); addn. of dioctylether to THF soln. of Superhydride, stirring for 1.5 at 90°C in vac., addn. of gallium compd.; centrifugation, washing with THF, drying in vac. for 20 min; |
Conditions | Yield |
---|---|
In neat (no solvent) Ga, As evacuated, closed in an outgassed quartz ampoule at .apprx.1E-4 Pa, heated at 580.+-.20°C, 140h; | 100% |
With iodine In neat (no solvent) stoichiometric amts. of Ga and As heated at 1000°C for 5 days at the presence of a small amts. of iodine; identified by X-ray diffraction; | |
In gas gas phase reaction of Ga and As vapour at 1E-10 Torr; |
Conditions | Yield |
---|---|
In neat (no solvent) Ge, Ga and Sb placed in evacuated (1E-2 Pa), sealed quartz ampoules, annealed (800°C, 1400 h); single phase (microstructural analysis), samples prepared with total of 0.25 at.% dopant (Ge = 99.75 at.%) and others with total dopant content of 5 E19 cm-3, also Ge:Sb = 3:1, 1:1 and 1:3; | 100% |
Conditions | Yield |
---|---|
In neat (no solvent) stoich. mixt. sealed in Ta tubes under Ar; Ta tubes sealed in silica ampoules (1E-2 mbar); heated (900°C, 20 d); | 100% |
Conditions | Yield |
---|---|
In neat (no solvent) Ge and Ga placed in evacuated (1E-2 Pa), sealed quartz ampoules, annealed (800°C, 1400 h); single phase (microstructural analysis), dopant content of 5 E19 cm-3; | 100% |
Conditions | Yield |
---|---|
In neat (no solvent) Ga, Sb evacuated, closed in an outgassed quartz ampoule at .apprx.1E-4 Pa, heated at 580.+-.20°C, 140h; | 100% |
melting in a quartz crucible in flowing hydrogen (purified over Pd, flow rate 70 ml/min); for compensation of evapn. of Sb, 0.1% excess Sb was applied;; | |
In neat (no solvent) Sb/Ga flux ratio was approx. 8.5, GaAs(001) as substrate, mol. beam epitaxy; |
Conditions | Yield |
---|---|
In neat (no solvent) stoich. mixt. sealed in Ta tubes under Ar; Ta tubes sealed in silica ampoules (1E-2 mbar); heated (850°C, 20 d); | 100% |
Conditions | Yield |
---|---|
In neat (no solvent) stoich. mixt. sealed in Ta tubes under Ar; Ta tubes sealed in silica ampoules (1E-2 mbar); heated (950°C, 33 d); | 100% |
Conditions | Yield |
---|---|
In neat (no solvent, solid phase) all manipulations under Ar atm.; stoich. mixt. of compds. sealed in Ta tubes then tubes sealed inside silica ampoules under vac. (ca. 1E-2 mbar), heated at 930°C for 36 d; | 100% |
Conditions | Yield |
---|---|
With gallium(III) trichloride for 5h; Inert atmosphere; Reflux; | 100% |
Conditions | Yield |
---|---|
With gallium(III) trichloride for 2h; Inert atmosphere; Reflux; | 100% |
Conditions | Yield |
---|---|
In toluene at 30℃; Glovebox; Inert atmosphere; Sonication; | A n/a B 100% C n/a |
Conditions | Yield |
---|---|
In melt 5 mol% excess of gaseous chlorine passed through metal gallium melt; | 99% |
excess Cl2;; | |
mixt. heating (two-section glass tube, 200-250°C); vac. sublimation (water pump, ca. 250°C); |
Conditions | Yield |
---|---|
In melt mixing of Y, Ga and Ge in ratio Y:Ga:Ge as 1:15:1 under N2; slowly heating (60°C/h) up to 1000°C; holding at 1000°C for 5 h; cooling (75°C/h) to 850°C; holding isothermally for 6 days; cooling to 200°C; hot-temp. span-filtration; treatment with 3 M soln. of I2 in DMF for 12-24 h; rinsing with DMF, hot water, drying with acetone and ether; | 99% |
Conditions | Yield |
---|---|
In melt mixing of Yb, Ga and Ge in ratio Yb:Ga:Ge as 1:15:1 under N2; slowly heating (60°C/h) up to 1000°C; holding at 1000°C for 5h; cooling (75°C/h) to 850°C; holding isothermally for 6 days; cooling to 200°C; hot-temp. span-filtration; treatment with 3 M soln. of I2 in DMF for 12-24 h; rinsing with DMF, hot water, drying with acetone and ether; | 99% |
Conditions | Yield |
---|---|
In melt mixing of Sm, Ga and Ge in ratio Sm:Ga:Ge as 1:15:1 under N2; slowly heating (60°C/h) up to 1000°C; holding at 1000°C for 5h; cooling (75°C/h) to 850°C; holding isothermally for 6 days; cooling to 200°C; hot-temp. span-filtration; treatment with 3 M soln. of I2 in DMF for 12-24 h; rinsing with DMF, hot water, drying with acetone and ether; | 99% |
Conditions | Yield |
---|---|
In melt Ga mixed with 1 mol% Er in presence of wetting agent Bi in quartz tube placed in furnace, after purging with Ar for 1 h, heating under Ar flow at 950-1050 °C, gas switched from Ar to NH3, temp. held for 3-5 h; | 99% |
In gas Ga and Er were deposited on sapphire substrate at 700°C under ammonia flow; |
Conditions | Yield |
---|---|
In not given recrystn. (Et2O); | 99% |
Conditions | Yield |
---|---|
In nitromethane at 20℃; for 1.5h; Sonication; | 99% |
Conditions | Yield |
---|---|
Stage #1: gallium; water With hydrogenchloride; potassium oxalate; urea at 20℃; for 0.5h; Stage #2: at 179.84℃; for 3h; Reagent/catalyst; Autoclave; | 99% |
Conditions | Yield |
---|---|
Heating; | 99% |
In neat (no solvent) |
Conditions | Yield |
---|---|
In neat (no solvent) Al and Ga metals were heated in sealed quartz tube to 700° and then cooled to room temp.; | 98% |
In neat (no solvent) | |
In neat (no solvent) | |
In neat (no solvent) melting Ga and Al in a porcelain tube in vac.;; |
Conditions | Yield |
---|---|
In toluene N2 atmosphere; refluxing (24 h); removal of solvent; elem. anal.; | 98% |
Conditions | Yield |
---|---|
In toluene 1:3 mixt. refluxed in toluene for 18 h (until metal was completely dissolved); filtration, evapd. to dryness, elem. anal.; | 98% |
gallium
2,6-bis[1-[(2,6-di(iso-propyl)phenyl)imino]-benzyl]pyridine
iodine
toluene
Conditions | Yield |
---|---|
In toluene Sonication; (under N2); Ga and I2 added to soln. of ligand in toluene, sealed, sonicated for 3 h, stirred overnight; filtered, washed with hexane, dried under vac.; | 98% |
Conditions | Yield |
---|---|
With methylene chloride; sodium at 40 - 50℃; under 375.038 Torr; Inert atmosphere; Flow reactor; | A 93.7% B 96.8% |
Gallium (CAS NO.7440-55-3) was first discovered by Paul Emile Lecoq de Boisbaudran in 1875 by its characteristic spectrum in an examination of a zinc blende from the Pyrenees. Later, in 1875, Lecoq obtained the free metal by electrolysis of its hydroxide in potassium hydroxide solution. He named the element "gallia" after his native land of France.
Reported in EPA TSCA Inventory.
DOT Classification: 8; Label: Corrosive
The Gallium, with the cas registry number 7440-55-3, is a kind of silvery-white liquid at room temperature. This is stable chemically and sensitive to moisture and is incompatible with strong acids, strong bases, halogens, strong oxidizing agents.
Its product categories are including Inorganics; Gallium; Metal and Ceramic Science; Metals; AA Standard SolutionsAnalytical Standards; GSpectroscopy; AAS; Alphabetic; Matrix Selection; NitrateSpectroscopy; Reference/Calibration Standards; Single Solution; Standard Solutions; Analytical Standards; GApplication CRMs; ICP CRMs; ICP-OES/-MS; ICPSpectroscopy; Spectroscopy.
The physical properties of this chemical are as below: (1)#H bond acceptors: 0; (2)#H bond donors: 0; (3)#Freely Rotating Bonds: 0; (4)Polar Surface Area: 0; (5)Exact Mass: 68.925581; (6)MonoIsotopic Mass: 68.925581; (7)Heavy Atom Count: 1; (8)Covalently-Bonded Unit Count: 1.
The production method of this chemical is below: add the high purity gallium solvent into the reactor and stir and then add oxalic acid to have the reduction reaction; Next filter and then wash with the deionized water, and then you could get the high purity products.
When you are dealing with this chemical, you should be very careful. For one thing, it is irritant which may cause inflammation to the skin or other mucous membranes and it is irritating to eyes and skin. For another thing, it is toxic which may at low levels cause damage to health. It will be toxic if by inhalation, in contact with skin and if swallowed. In addition, it is corrosive which may destroy living tissue on contact and may causes burns.
Due to so many dangers mentioned above, you should take different measures to deal with different cases. Wear suitable protective clothing, gloves and eye/face protection. If in case of contact with eyes, rinse immediately with plenty of water and seek medical advice and if in case of accident or if you feel unwell, seek medical advice immediately (show label). After contact with skin, wash immediately with plenty of ... (to be specified by the manufacturer). Besides, take off immediately all contaminated clothing.
As to its usage, it is widely applied in many fields. It could be used in producing semiconductor [semiconducting] material and high purity alloy; It could be used as a dopant for the production of solid-state devices such as transistors, and as a component in low-melting alloys and solders. In addition, it can be used to fight bacterial infections in people with cystic fibrosis.
In addition, you could obtain the molecular structure by using the following datas:
(1)Canonical SMILES: [Ga]
(2)InChI: InChI=1S/Ga
(3)InChIKey: GYHNNYVSQQEPJS-UHFFFAOYSA-N
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