carbon monoxide
copper
A
copper(l) iodide
B
tetracarbonyl nickel
Conditions | Yield |
---|---|
In neat (no solvent) High Pressure; in autoclave at 200 atm and 200 - 250°C;; | A n/a B 100% |
In neat (no solvent) High Pressure; in autoclave at 120 - 180°C;; | A n/a B 100% |
SmI2(O(CH2)4)4
copper (I) tert-butoxide
A
copper(l) iodide
C
copper
Conditions | Yield |
---|---|
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of t-BuOCu added to a blue-green soln. of Sm complex; ppt. sepd. and washed with 10% HNO3; ppt. of CuI insoluble in HNO3 sepd. off; remaining soln. concd. and kept at 80° until complete dissolution of a fine ppt.; cooled slowly to ca. 20°; crystal sepd.; dried; identified by elem. anal., IR; | A 100% B 97.7% C 92.3% |
LaI3(tetrahydrofuran)3
copper (I) tert-butoxide
A
copper(l) iodide
Conditions | Yield |
---|---|
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of La complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum; | A 90.2% B 95% |
tris(tetrahydrofurane)triiodidoneodymium(III)
copper (I) tert-butoxide
A
copper(l) iodide
Conditions | Yield |
---|---|
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of Nd complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum; | A n/a B 90.3% |
iodine
copper
copper(l) iodide
Conditions | Yield |
---|---|
In acetone | |
In neat (no solvent) on treatment with I2-vapors at 360°C;; | |
vapor deposited Cu film was inserted into an iodine-containing reacted atmosphere;; |
Conditions | Yield |
---|---|
In water pptg. from a CuCl2*2H2O soln. with an excess of KI soln.; Debye-Scherrer XRD; |
Conditions | Yield |
---|---|
With copper(II) sulfate In not given iodine containing compounds used; | |
With alkali sulfite; copper(II) sulfate In not given iodine containing compounds used; |
Conditions | Yield |
---|---|
In water; xylene byproducts: CuBr2; shaking a soln. of CuBr in concd. Br(1-) soln. with I2 in xylol, reversible react.;; |
Conditions | Yield |
---|---|
In water; xylene byproducts: CuCl2; shaking a soln. of CuCl in concd. Cl(1-) soln. with I2 in xylol, reversible react.;; |
Conditions | Yield |
---|---|
In ethanol Kinetics; alcoholic soln. of iodine addn. to AgCl in container with ground stopper, keeping for 2, 4 or 8 h at 60°C; X-ray diffraction; |
Conditions | Yield |
---|---|
In acetone on addn. of a soln. of excess I2 acetone;; |
iodine
copper
potassium iodide
copper(l) iodide
Conditions | Yield |
---|---|
In water Kinetics; |
Conditions | Yield |
---|---|
in presence of Cu(2+); |
iodine
copper
molybdenum
copper(l) iodide
Conditions | Yield |
---|---|
In neat (no solvent, solid phase) byproducts: Cu(y)MoO(3-z); molar ratio Cu:Mo:O:I 3:8:23:3, heating (48 h, 500°C, vac.); X-ray diffraction; |
iodine
copper
molybdenum
B
copper(l) iodide
Conditions | Yield |
---|---|
In neat (no solvent, solid phase) molar ratio Cu:Mo:O:I 3:12:31:3, heating (48 h, 500°C, vac.); X-ray diffraction; |
iodine
copper
A
copper(l) iodide
Conditions | Yield |
---|---|
300-340 K, total pressure E-3 Torr; monitored by laser-induced fluorescence spectroscopy; |
Conditions | Yield |
---|---|
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuF2 at 60°C; X-ray diffraction; |
Conditions | Yield |
---|---|
With sulfur dioxide In water Cu salts from Cu minerals;; |
iodine
copper(ll) bromide
A
copper(l) iodide
B
copper(I) bromide
Conditions | Yield |
---|---|
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuBr2 at 60°C; X-ray diffraction; |
Conditions | Yield |
---|---|
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuCl2 at 60°C; X-ray diffraction; |
Conditions | Yield |
---|---|
In neat (no solvent) byproducts: aldehyde, O2, ethylene, methane, hydrocarbons; at about 310°C in aCO2-atmoshere;; | |
In neat (no solvent) on treatment of CuO with gaseous methyl iodide;; |
copper
methyl iodide
copper(l) iodide
Conditions | Yield |
---|---|
In gaseous matrix Kinetics; byproducts: CH3; Ar carrier gas; heating (300 - 696 K); not isolated; |
Iodine monochloride
copper
A
copper(l) iodide
Conditions | Yield |
---|---|
In neat (no solvent) byproducts: I2, CuCl2;; High Pressure; | |
In neat (no solvent) byproducts: I2, CuCl2;; High Pressure; |
Conditions | Yield |
---|---|
In neat (no solvent) on heating to 400-500°C;; | |
In neat (no solvent) on heating to 400-500°C;; |
Conditions | Yield |
---|---|
Kinetics; solid body react. under N2 at 200-300°C; | |
Kinetics; solid body react. in vac.at 200-300°C; | |
Kinetics; solid body react. under N2 at 200-300°C; | |
Kinetics; solid body react. in vac.at 200-300°C; |
Conditions | Yield |
---|---|
In hydrogenchloride pptn. with KI;; | |
In water pptn. from the soln. of CuCl in aq. NH4Cl with KI;; | >99 |
In water react. of CuCl with KI-soln. with passing through of N2; washing with alcohol on a filter, drying in N2 flow and then in vacuum; | |
In hydrogenchloride |
Conditions | Yield |
---|---|
In water formation of crystals;; |
Conditions | Yield |
---|---|
With hydrogenchloride; hydroxylamine hydrochloride; gelatin In water byproducts: N2O, KCl; NH2OH*HCl, KI added rapidly to gelatin stabilized CuO suspn. with stirring for 5 h under agitation at room temp., pH adjusted to 8-9 with HCl; washed thoroughly, vacuum dried at room temp.; |
copper(l) iodide
Conditions | Yield |
---|---|
In diethyl ether; acetonitrile at 20℃; for 2h; | 100% |
copper(l) iodide
sodium tetraphenyl borate
copper
Conditions | Yield |
---|---|
In 1,2-dimethoxyethane Irradiation (UV/VIS); under Ar; mole ratio NaBPh4 : CuI = 1 : 1; irradn. (254 nm) for 1 h gave deposition of Cu; deposit sepd., washed with acetone and water, and dried in vac. to give pure Cu; | 100% |
Conditions | Yield |
---|---|
With N,N,N,N,N,N-hexamethylphosphoric triamide In tetrahydrofuran; diethyl ether under N2, etheral soln. of MeLi was added to a stirred suspn. of CuI in THF at -10°C, HMPT was also added, stirred for 30 min at 0°C; not isolated; | 100% |
Conditions | Yield |
---|---|
In tetrahydrofuran at 48℃; Inert atmosphere; | 100% |
In acetonitrile dissolving CuI and NPr4I in MeCN, concg.; |
Conditions | Yield |
---|---|
In dichloromethane; acetonitrile at 20℃; for 2h; | 100% |
Conditions | Yield |
---|---|
In tetrahydrofuran; tert-butyl methyl ether at 10 - 48℃; for 0.75h; Inert atmosphere; | 100% |
In tetrahydrofuran at 50℃; Inert atmosphere; | 600 g |
Stage #1: copper(l) iodide; tetra-(n-butyl)ammonium iodide In tetrahydrofuran at 50℃; Inert atmosphere; Stage #2: In tert-butyl methyl ether at 6℃; for 1h; Inert atmosphere; | 600 g |
copper(l) iodide
Conditions | Yield |
---|---|
In tetrahydrofuran at 20℃; for 18h; Inert atmosphere; Schlenk technique; stereoselective reaction; | 100% |
Conditions | Yield |
---|---|
Stage #1: copper(l) iodide; lead(II) nitrate; potassium iodide In water for 2h; Stage #2: at 620℃; for 72h; Sealed tube; | 100% |
copper(l) iodide
5-chloro-2-(pent-4-yn-1-yl)pyrimidine
Conditions | Yield |
---|---|
With potassium carbonate In N,N-dimethyl-formamide at 20℃; for 3h; Inert atmosphere; | 100% |
Conditions | Yield |
---|---|
In tetrahydrofuran | 100% |
copper(l) iodide
2,6-bis(5-(tert-butyl)-1H-pyrazol-3-yl)pyridine
Conditions | Yield |
---|---|
In tetrahydrofuran for 24h; Inert atmosphere; Schlenk technique; | 100% |
copper(l) iodide
[((p-tert-butyl)C6H4)2B(CH2P(phenyl)2)2][5-azoniaspiro[4.4]nonane]
[[(p-(t)BuPh)2B(CH2PPh2)2]CuI][5-azonia-spiro[4.4]nonane]
Conditions | Yield |
---|---|
In tetrahydrofuran; ethanol equiv. amt. of solid CuI and B-compd. were mixed in THF:EtOH=4:0.3, stirring for 2.5 h; volatiles were removed in vac., solid was washed with Et2O, dried in vac., elem. anal.; | 99.4% |
copper(l) iodide
6-bromo-2,2,4,4-tetramethyl chroman-8-carbaldehyde
trimethylsilylacetylene
6-Trimethylsilanylethynyl-2,2,4,4-tetramethyl chroman-8-carbaldehyde
Conditions | Yield |
---|---|
With triethylamine; dichlorobis(triphenylphosphine)palladium[II] In tetrahydrofuran; hexane | 99% |
copper(l) iodide
ethyl 8-iodo-2,2,4,4-tetramethyl-chroman-6-carboxylate
trimethylsilylacetylene
Ethyl-8-trimethylsilanyl-ethynyl-2,2,4,4-tetramethyl chroman-6-carboxylate
Conditions | Yield |
---|---|
dichlorobis(triphenylphosphine)palladium[II] In hexane; triethylamine | 99% |
Conditions | Yield |
---|---|
In diethyl ether at -78 - -35℃; for 0.333333h; Inert atmosphere; | 99% |
In tetrahydrofuran Ar, ratio CuI:CH3Li = 1:2; | |
In hexane |
Conditions | Yield |
---|---|
With KI In water pyridine was added to stirred soln. of CuI in concd. aq. KI; filtered; washed (satd. aq. KI, H2O, MeOH, hexane); recrystd. (CH2Cl2/pentane); dried (vac.); | 99% |
In ethanol at 20℃; for 0.5h; Sealed tube; | 80% |
With potassium iodide In water |
copper(l) iodide
Iodotrifluoroethylene
cadmium
trifluorovinyl copper
Conditions | Yield |
---|---|
In N,N-dimethyl-formamide byproducts: CdI2; N2; slight excess of acid-washed Cd powder added to alkene soln.; mild exothermic reaction after induction period; removal of excess Cd by press. filtrn. under N2; stirring mixt. at 0 °C for half h with CuI or CuBr; final warming to room temp.; (19)F NMR; | 99% |
copper(l) iodide
Conditions | Yield |
---|---|
In not given treated at room temp. for 24 h; further intermediate; followed by UV and by ESI-MS; | 99% |
Conditions | Yield |
---|---|
In dichloromethane piperidine was dissolved in CH2Cl2 under N2 at 25°C; CuI was added; mixt. was stirred under N2 until CuI dissolved; | 99% |
With potassium iodide In acetone excess of ligand in acetone soln. is added to a stirred soln. of CuI in concd. aq. KI soln., soln. kept standing for a few min, pptn.; filtn., washing with satd. aqueous KI, water, MeOH and hexanes, product is dried in vac.; | >99 |
With potassium iodide In water |
Conditions | Yield |
---|---|
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1); | 99% |
Conditions | Yield |
---|---|
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1); | 99% |
N,N'-ethylenethiourea
copper(l) iodide
tris(iodobis(ethylenethiourea)copper(I))
Conditions | Yield |
---|---|
In N,N-dimethyl-formamide CuI, ethylenethiourea and few drops DMF were ground together for severalminutes; DMF was evapd.; | 99% |
In water CuI and ethylenethiourea in water were heated to boiling; supernatant was decanted while hot and cooled, product was collected andwashed with water; elem. anal.; | 50% |
copper(l) iodide
triacetylacetonatotripyridinetetrasulfido trimolybdenum hexafluorophosphate
benzene
Conditions | Yield |
---|---|
In dichloromethane; acetonitrile; benzene stoich., CuI added to soln. of Mo complex in CH2Cl2, evapd., dissolved (CH3CN), benzene deposited; crystd. for 3 d, elem. anal.; | 99% |
copper(l) iodide
4,5-bis(diphenylphosphino)-9,9-dimethylxanthene
Cu[9,9-dimethyl-4,5-bis(diphenylphosphine)xanthene]I
Conditions | Yield |
---|---|
In acetonitrile | 99% |
In CH2Cl2 | 99% |
In acetonitrile at 50℃; for 2h; | 99% |
copper(l) iodide
1,2-bis(diphenylphosphino)-1′-(diisopropylphosphino)-4-tert-butylferrocene
P,P',P''-[1,2-bis(diphenylphosphino)-1'-(diisopropylphosphino)-4-tert-butylferrocene]iodocopper(I)
Conditions | Yield |
---|---|
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.; | 99% |
copper(l) iodide
1-diphenylphosphino-2-diphenylphosphino-4-tert-butyl-cyclopentadienyl-1'-diphenylphosphino-3'-tert-butyl-cyclopentadienyliron
P,P',P''-[1,1',2-tris(diphenylphosphino)-3',4-di-tert-butylferrocene]iodocopper(I)
Conditions | Yield |
---|---|
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.; | 99% |
copper(l) iodide
bis(diethylamino)-2,3,4,5,6-pentafluorophenylphosphane
bis[bis(diethylamino)(pentafluorophenyl)phosphate]iodidocopper(I)
Conditions | Yield |
---|---|
In chloroform-d1 inert gas; CuI (0.36 mmol) added to soln. of ligand (0.70 mmol), mixt. stirred at room temp. for 30 min; filtered, evapd.; | 99% |
copper(l) iodide
tris(3,5-dimethylpyrazolyl)methane
(tris(3,5-dimethyl-1-pyrazolyl)methane)CuI
Conditions | Yield |
---|---|
In acetonitrile under N2; soln. of ligand in MeCN added to stirred soln. of CuI in MeCN;stirred for 2 h; filtered; ppt. dried under vac.; elem. anal.; | 99% |
at 20℃; |
When heated to decomposition it emits toxic fumes of I−.
Safety Information of Cuprous iodide(7681-65-4)
Hazard Codes Xn,N,Xi
Risk Statements 22-36/37/38-50/53
Safety Statements 22-24/25-26-61
RIDADR UN 3077 9/PG 3
WGK Germany 3
F 8
HS Code 28276000
Stability and Reactivity of Cuprous iodide(7681-65-4)
【Disposal Code】15
【Incompatibilities】Oxidizing agents, alkali metals, potassium, acetylene.
【Stability】Stable under normal temperatures and pressures.
【Decomposition】Hydrogen iodide, iodine.
【Combustion Products】Fire may produce irritating, corrosive and/or toxic gases.
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